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Patent Searching and Data


Title:
CONNECTING BODY, AND METHOD FOR MANUFACTURING CONNECTING BODY
Document Type and Number:
WIPO Patent Application WO/2021/187591
Kind Code:
A1
Abstract:
Provided are a connecting body and a method for manufacturing a connecting body with which a fine pitch can be achieved, and with which miniaturization can be achieved. The connecting body is provided with a base board (10) having a first terminal row (11), a connector (20) having a second terminal row (21A) to (21E), and an adhesive layer (30) obtained by curing a thermosetting connecting material connecting the first terminal row (11) and the second terminal row (21), wherein the second terminal row (21A) to (21E) is disposed on the bottom surface of the connector (20), and forms a step absorbing portion which absorbs steps in the bottom surface, and the thermosetting connecting material contains solder particles and a flux component. By this means, the first terminal row (11) and the second terminal row (21A) to (21E) can be connected to one another, and therefore the terminal rows can be provided at a fine pitch, and the connecting body can be miniaturized.

Inventors:
ODAKA RYOSUKE (JP)
ITO RYO (JP)
KUMAKURA HIROYUKI (JP)
ABE TOMOYUKI (JP)
SATO DAISUKE (JP)
ORIHARA KATSUHISA (JP)
AOKI KAZUHISA (JP)
Application Number:
PCT/JP2021/011169
Publication Date:
September 23, 2021
Filing Date:
March 18, 2021
Export Citation:
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Assignee:
DEXERIALS CORP (JP)
International Classes:
H01R12/71; H01R43/00
Domestic Patent References:
WO2016114160A12016-07-21
Foreign References:
JPH08508610A1996-09-10
JPH0615269U1994-02-25
Attorney, Agent or Firm:
NOGUCHI, Nobuhiro (JP)
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