Title:
CONNECTING METHOD FOR INSULATING LAYER OF LEAKY CABLE
Document Type and Number:
WIPO Patent Application WO/2022/111306
Kind Code:
A1
Abstract:
The present application relates to a connecting method for foam of a leaky cable. The use of a lower mold and an upper mold which are semi-cylindrical has the advantage of being convenient to mount; the outer surface of foam can be heated by means of a resistance-heating coil, and in combination with pressurization, the outer surface of the foam is thermally shrunk; and then an inner conductor is heated by means of an electromagnetic induction heating coil, such that the outer surface of the foam is thermally shrunk, such that the foam for connection is connected to foam bodies on two sides, and the connection is firmer and is not easily broken.
Inventors:
SHEN XIAOPING (CN)
GUO HONGBIAO (CN)
SUN SHENGJUN (CN)
SHEN LINLIN (CN)
SHEN JIANCHENG (CN)
GUAN ZHICHAO (CN)
SHEN WEIKANG (CN)
WEI JINGJING (CN)
GUO HONGBIAO (CN)
SUN SHENGJUN (CN)
SHEN LINLIN (CN)
SHEN JIANCHENG (CN)
GUAN ZHICHAO (CN)
SHEN WEIKANG (CN)
WEI JINGJING (CN)
Application Number:
PCT/CN2021/130266
Publication Date:
June 02, 2022
Filing Date:
November 12, 2021
Export Citation:
Assignee:
TONGDING INTERCONNECTION INFORMATION CO LTD (CN)
International Classes:
H01B11/18; H01B13/016; H01B13/00; H01Q13/20
Foreign References:
| CN112721177A | 2021-04-30 | |||
| CN112700929A | 2021-04-23 | |||
| JPH05266958A | 1993-10-15 | |||
| CN110350376A | 2019-10-18 | |||
| CN209200188U | 2019-08-02 | |||
| CN101950838A | 2011-01-19 |
Attorney, Agent or Firm:
SUZHOU ZHITU INTELLECTUAL PROPERTY FIRM (CN)
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