Title:
CONNECTING STRUCTURE OF FLEXIBLE SUBSTRATE THIN FILM BULK ACOUSTIC WAVE FILTER
Document Type and Number:
WIPO Patent Application WO/2020/132993
Kind Code:
A1
Abstract:
A connecting structure of a flexible substrate thin film bulk acoustic wave filter, comprising: a first top electrode and a second top electrode, wherein a gap is formed between said top electrodes; piezoelectric layers (511, 611, 720, 811, 911, 1011) below the first top electrode and the second top electrode; one or two bottom electrodes (512, 612, 730, 812, 912, 1012) below the piezoelectric layers (511, 611, 720, 811, 911, 1011); and a flexible substrate (520, 620, 750, 820, 920, 1020) below the bottom electrode (512, 612, 730, 812, 912, 1012); wherein the piezoelectric layers (511, 611, 720, 811, 911, 1011) is not arranged below the gap between the two top electrodes (510, 610, 710, 810, 910, 1010).
Inventors:
PANG WEI (CN)
GAO CHUANHAI (CN)
ZHANG MENGLUN (CN)
GAO CHUANHAI (CN)
ZHANG MENGLUN (CN)
Application Number:
PCT/CN2018/124073
Publication Date:
July 02, 2020
Filing Date:
December 26, 2018
Export Citation:
Assignee:
UNIV TIANJIN (CN)
ROFS MICROSYSTEM TIANJIN CO LTD (CN)
ROFS MICROSYSTEM TIANJIN CO LTD (CN)
International Classes:
H03H3/02; H03H9/02; H03H9/15; H03H9/56
Foreign References:
| CN108092639A | 2018-05-29 | |||
| CN108092639A | 2018-05-29 | |||
| CN107196618A | 2017-09-22 | |||
| CN102075161A | 2011-05-25 | |||
| JPH11136074A | 1999-05-21 |
Attorney, Agent or Firm:
CHINA SMART INTELLECTUAL PROPERTY LTD. (CN)
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