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Title:
CONNECTION MATERIAL, CONNECTION STRUCTURE, AND METHOD FOR PRODUCING CONNECTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2024/090129
Kind Code:
A1
Abstract:
Provided are a connection material with which it is possible to obtain excellent connection reliability and repairability, a connection structure, and a method for producing a connection structure. The connection material contains an ionically polymerizable compound, an ionic polymerization initiator, and a caprolactone derivative. The content of the caprolactone derivative is 5-40 mass parts per 100 total mass parts of the ionically polymerizable compound and the caprolactone derivative. The glass transition temperature of the cured product can be adjusted thereby, and excellent connection reliability and repairability can be obtained.

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Inventors:
YANAGIYA HIROMU (JP)
YAMAGUCHI ETSUKO (JP)
Application Number:
PCT/JP2023/035402
Publication Date:
May 02, 2024
Filing Date:
September 28, 2023
Export Citation:
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Assignee:
DEXERIALS CORP (JP)
International Classes:
C09J163/00; C09J9/02; C09J11/04; C09J11/06; C09J11/08
Domestic Patent References:
WO2021117396A12021-06-17
Foreign References:
JP2008214449A2008-09-18
JP2007169337A2007-07-05
JPH1161078A1999-03-05
JP2018524426A2018-08-30
Attorney, Agent or Firm:
NOGUCHI, Nobuhiro (JP)
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