Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
CONNECTION STRUCTURE, CIRCUIT DEVICE, AND ELECTRONIC EQUIPMENT
Document Type and Number:
WIPO Patent Application WO/2010/103591
Kind Code:
A1
Abstract:
A connection structure which allows terminals having different functions to be connected in insulated states separately, while minimizing the occurrence of cracks, peeling of terminals, and other defects; a circuit device provided with the connection structure; and electronic equipment provided with the circuit device. The connection structure (30) electrically and mechanically connects a connector board (20) and a circuit board (10) and is provided with: a frame (31) which comprises at least a first connection surface (31A) which is connected to the connector board (20), a second connection surface (31B) which is connected to the circuit board (10), and a first side surface (31C) and a second side surface (31D) which intersect the first connection surface (31A) and second connection surface (31B); and ground terminals (32) which are formed at portions of the first connection surface (31A), second connection surface (31B), first side surface (31C), and second side surface (31D) so as to have ring shapes at the frame cross section. A plurality of ground terminals (32) are formed in the longitudinal direction of the frame (31), and at least two ground terminals (32) are conductively connected at the second side surface (31D).

Inventors:
KAWABATA MASAHITO
Application Number:
PCT/JP2009/006175
Publication Date:
September 16, 2010
Filing Date:
November 17, 2009
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
PANASONIC CORP (JP)
KAWABATA MASAHITO
International Classes:
H05K1/14
Domestic Patent References:
WO2007116657A12007-10-18
WO2007007627A12007-01-18
Foreign References:
JP2005333046A2005-12-02
JPH0745982A1995-02-14
JP2006173152A2006-06-29
JP2008311335A2008-12-25
JP2006237276A2006-09-07
JP2009059755A2009-03-19
Attorney, Agent or Firm:
OGURI, Shohei et al. (JP)
Shohei Oguri (JP)
Download PDF: