Title:
CONNECTION STRUCTURE OF CONDUCTIVE MEMBER AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE OF CONDUCTIVE MEMBER
Document Type and Number:
WIPO Patent Application WO/2019/035386
Kind Code:
A1
Abstract:
The purpose of the present invention is to ultrasonically join a plurality of conductive members with as much bonding force as possible. A conductive member has a connection structure in which the plurality of conductive members are connected through a bonding part (30) that has been bonded by ultrasonic bonding from a plurality of directions. One example of the conductive member is a core wire (22a) exposed in an electric wire (20) including a core wire (22) and a covering (24) that covers the core wire (22). For example, the bonding part (30) is a portion formed by ultrasonic bonding from two directions (D1, D2) in which the plurality of conductive members are orthogonal to each other.
Inventors:
NAKAMURA YO (JP)
SUZUKI TAKUYA (JP)
TAMAGAWA TATSUO (JP)
MIURA DAICHI (JP)
SUZUKI TAKUYA (JP)
TAMAGAWA TATSUO (JP)
MIURA DAICHI (JP)
Application Number:
PCT/JP2018/029515
Publication Date:
February 21, 2019
Filing Date:
August 07, 2018
Export Citation:
Assignee:
SUMITOMO WIRING SYSTEMS (JP)
International Classes:
H01R4/02; H01B7/00; H01B13/00; H01R43/02; H02G1/14
Foreign References:
| JP2010218796A | 2010-09-30 |
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
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