Title:
CONNECTION STRUCTURE AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2023/189711
Kind Code:
A1
Abstract:
A connection structure in which an electrode of a first electronic component and an electrode of a second electronic component are aligned so as to face each other, and the first electronic component and the second electronic component are connected via electroconductive particles and an insulating adhesive agent disposed between the aligned electrodes, wherein electrconductive particles having an average particle diameter of less than 3 µm are used, there is alignment skew in the mutually facing electrodes, and the width of the alignment skew in the connection structure is adjusted to no more than 10.0 times the average particle diameter of the electroconductive particles.
Inventors:
WATANABE NOBUE (JP)
YOSHIMOTO RYUSUKE (JP)
YOSHIMOTO RYUSUKE (JP)
Application Number:
PCT/JP2023/010542
Publication Date:
October 05, 2023
Filing Date:
March 17, 2023
Export Citation:
Assignee:
DEXERIALS CORP (JP)
International Classes:
H01R11/01; C09J7/35; C09J9/02; H01B1/00; H01B1/22; H01B5/16; H01L21/60; H01R43/00; H05K3/32
Foreign References:
| JP2012015544A | 2012-01-19 | |||
| JP2016014115A | 2016-01-28 | |||
| JP2015135878A | 2015-07-27 |
Attorney, Agent or Firm:
TAJIME & TAJIME (JP)
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