CONNECTOR WIRE, AND MANUFACTURING METHOD THEREOF

Title:

CONNECTOR WIRE, AND MANUFACTURING METHOD THEREOF

Document Type and Number:

WIPO Patent Application WO/2002/103086

Kind Code:

A1

Abstract:

A connector wire (1) which is used as a connector material of a component of an electric or electronic device, and a manufacturing method thereof. The connector wire (1) has a lower plating layer comprising two layers, i.e., a nickel plating layer (12) and a copper plating layer (13) which are successively formed on a wire material (11) made of copper or a copper alloy. An upper reflow plating layer (14) made of tin or a tin alloy is formed on the lower plating layer.

Inventors:

OTANI MINORI
DOHI NOBUYASU
ICHIMONJI TAKESHI

Application Number:

PCT/JP2002/005811

Publication Date:

December 27, 2002

Filing Date:

June 10, 2002

Export Citation:

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Assignee:

NIPPON SHINDO CO LTD (JP)

International Classes:

C25D5/12; C25D7/06; (IPC1-7): C25D7/00; C25D5/12; C25D7/06

Foreign References:

JPS61177393A	1986-08-09
JPH04165096A	1992-06-10
JPH11350188A	1999-12-21

Attorney, Agent or Firm:

Kurauchi, Giro (Nishitemma 4-chome Kita-ku Osaka-shi, Osaka, JP)

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