Technical Field

The present disclosure relates to the field of electronic circuits. More particularly, the present disclosure relates to the connector designs to mate to an integrated circuit package.

Background

The background description provided herein is for the purpose of generally presenting the context of the disclosure. Unless otherwise indicated herein, the materials described in this section are not prior art to the claims in this application and are not admitted to be prior art by inclusion in this section.

As data transfer rates and operating frequencies increase in computer systems, crosstalk between signals on closely located contacts has become an issue. For example, high speed edge connectors that mate directly to a host fabric interface diving board of an integrated circuit have presented crosstalk risks. Lack of adequate crosstalk protection may lead to failures in the computer system, and/or may prevent utilization of signals operating above a certain threshold frequency.

Brief Description of the Drawings

Embodiments will be readily understood by the following detailed description in conjunction with the accompanying drawings. To facilitate this description, like reference numerals designate like structural elements. Embodiments are illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings.

Figure 1 illustrates an example connector, according to various embodiments.

Figure 2 illustrates an example interface arrangement of the connector of Figure 1, according to various embodiments.

Figure 3 illustrates another example connector, according to various embodiments.

Figure 4 illustrates a perspective view of an example contact arrangement of the connector of Figure 3, according to various embodiments.

Figure 5 illustrates a top view of the example contact arrangement of Figure 4, according to various embodiments.

Figure 6 illustrates end views of an example contact arrangement, according to various embodiments.

Figure 7 illustrates another example connector, according to various embodiments.

Figure 8 illustrates a perspective view of an example contact arrangement of the connector of Figure 7, according to various embodiments.

Figure 9 illustrates an example computing device that may employ the apparatuses and/or methods described herein.

Detailed Description

Herein described are apparatuses and systems for providing connectivity with an integrated circuit (IC) package. A connector for mating with an integrated circuit (IC) package may include a first set of contacts to couple to a first differential pair of the IC package and a second set of contacts to couple to a second differential pair of the IC package, the connector may further include an isolation wall located between the first set of contacts and the second set of contacts, the isolation wall to provide electrical isolation between the first set of contacts and the second set of contacts, wherein the isolation wall includes a conductive material.

In the following detailed description, reference is made to the accompanying drawings which form a part hereof wherein like numerals designate like parts throughout, and in which is shown by way of illustration embodiments that may be practiced. It is to be understood that other embodiments may be utilized and structural or logical changes may be made without departing from the scope of the present disclosure. Therefore, the following detailed description is not to be taken in a limiting sense, and the scope of embodiments is defined by the appended claims and their equivalents.

Aspects of the disclosure are disclosed in the accompanying description. Alternate embodiments of the present disclosure and their equivalents may be devised without parting from the spirit or scope of the present disclosure. It should be noted that like elements disclosed below are indicated by like reference numbers in the drawings.

Various operations may be described as multiple discrete actions or operations in turn, in a manner that is most helpful in understanding the claimed subject matter.

However, the order of description should not be construed as to imply that these operations are necessarily order dependent. In particular, these operations may not be performed in the order of presentation. Operations described may be performed in a different order than the described embodiment. Various additional operations may be performed and/or described operations may be omitted in additional embodiments.

For the purposes of the present disclosure, the phrase“A and/or B” means (A), (B), or (A and B). For the purposes of the present disclosure, the phrase“A, B, and/or C” means (A), (B), (C), (A and B), (A and C), (B and C), or (A, B and C). The description may use the phrases“in an embodiment,” or“in embodiments,” which may each refer to one or more of the same or different embodiments. Furthermore, the terms“comprising,”“including,”“having,” and the like, as used with respect to embodiments of the present disclosure, are synonymous.

As used herein, the term“circuitry” may refer to, be part of, or include an

Application Specific Integrated Circuit (ASIC), an electronic circuit, a processor (shared, dedicated, or group) and/or memory (shared, dedicated, or group) that execute one or more software or firmware programs, a combinational logic circuit, and/or other suitable components that provide the described functionality.

Figure 1 illustrates an example connector 100, according to various embodiments. The connector 100 may mate to an integrated circuit (IC) package. In particular, the connector 100 may include a housing 104 that receives a portion of the IC package. The housing 104 may have a recess 102 into which a portion of the IC package may be inserted. The portion of the IC package may be a host fabric interface (HFI) diving board of the IC package, wherein the HFI diving board may include one or more pads that are to couple to one or more contacts of the connector 100 when the connector 100 is mated to the IC package.

The housing 104 may further have one or more indents 106 that abut recess 102. The indents 106 may be located on one or more sides of the recess 102. In the illustrated embodiment, the indents 106 may be located at a first side 108 (which may be referred to as“a bottom side” of the recess 102) of the recess 102 and a second side (which may be referred to as“a top side” of the recess 102, and which is obscured due to the view angle) of the recess 102, wherein the second side is at an opposite side of the recess 102 from the first side 108. The indents 106 located at the second side of the recess 102 may be a mirror image of the indents 106 located at the first side 108 of the recess 102.

The connector 100 may include one or more contacts. Each of the contacts may be located within the indents 106, wherein each of the indents 106 may have one or more of the contacts located in the indent. A portion of the each of the contacts may extend outside of the indents 106 into the recess 102. As the connector 100 is mated with the IC package, the pads of the IC package may contact the portion of the contacts that extend outside of the indents 106 and may supply a force that causes the contacts to flex to be located toward, and/or within, the indents 106 when the IC package is mated with the connector 100. The contacts may maintain contact with the pads of the IC package when flexed.

The contacts may include a first differential contact 109. The first differential contact 109 may be located within a first indent l06a, wherein a portion of the first differential contact 109 may extend out of the second indent l06a into the recess 102. The first differential contact 109 may contact a first pad of the IC package when the connector is mated with the IC package, wherein the first pad is coupled to a first signal of a differential pair of the IC package.

The contacts may further include a second differential contact 110. The second differential contact 110 may be located within a second indent l06b, wherein a portion of the second differential contact 110 may extend out of the second indent l06b into the recess 102. The second indent l06b may be adjacent to the first indent l06a. The second differential contact 110 may contact a second pad of the IC package when the connector is mated with the IC package, wherein the second pad is coupled to a second signal of the differential pair of the IC package. In particular, the first signal coupled to the first pad and the second signal coupled to the second pad may together form a differential pair. Further, the first differential contact 109 and the second differential contact 110 may be a set of contacts that couples to the differential pair formed by the first signal and the second signal.

The contacts may further include a first ground contact 112 and a second ground contact 114. The first ground contact 112 may be located in a third indent l06c, wherein a portion of the first ground contact 112 may extend out of the third indent l06c into the recess 102. The third indent l06c may be located adjacent to the first indent l06a. The second ground contact 114 may be located in a fourth indent l06d, wherein a portion of the second ground contact 114 may extend out of the fourth indent l06d into the recess 102. The fourth indent l06d may be located adjacent to the second indent l06b, such that the first indent l06a and the second indent l06b are located between the third indent l06c and the fourth indent l06d. Accordingly, the first differential contact 109 and the second differential contact 110 may be located between the first ground contact 112 and the second ground contact 114. The first ground contact 112 and the second ground contact 114 may contact pads of the IC package that are coupled to a ground of the IC package when the connector 100 is mated to the IC package. The arrangement formed by the first differential contact 109, the second differential contact 110, the first ground contact 112, and the second ground contact 114 may be referred to as a differential contact arrangement throughout this disclosure. In particular, the first differential contact 109, the second differential contact 110, the first ground contact 112, and the second ground contact 114 may be referred to as a first differential contact arrangement 118.

The connector 100 may include a plurality of differential contact arrangements, wherein each of the differential contact arrangements include one or more of the features of the first differential contact 109, the second differential contact 110, the first ground contact 112, and the second ground contact 114 described above.

The illustrated embodiment of the connector 100 may include a second differential contact arrangement 120 located adjacent to the first differential contact arrangement 118. In particular, the second differential contact arrangement 120 may include a third ground contact 122, a third differential contact 124, a fourth differential contact 126, and a fourth ground contact 128, which are located within a fifth indent l06e, a sixth indent l06f, a seventh indent l06g, and an eighth indent l06h, respectively. The second differential contact arrangement 120 may include one or more of the features first differential contact arrangement 118. Further, the third differential contact 124 and the fourth differential contact 126 may contact pads of the IC package that are coupled to a second differential pair of the IC package when the connector 100 is mated to the IC package.

The housing 104 may include an isolation wall 116. The isolation wall 116 may be located between the first differential arrangement 118 and the second differential arrangement 120. In particular, the isolation wall 116 may be located between the fourth indent l06d and the fifth indent l06e, with the contacts of the first differential

arrangement 118 located on one side of the isolation wall 116 and the contacts of the second differential arrangement 120 located on an opposite side of the isolation wall 116. The isolation wall 116 may contact the IC package when the connector 100 is mated to the IC package, such that the isolation wall 116 is located between the flexed contacts of the first differential arrangement 118 and the flexed contacts of the second differential arrangement 120. In some embodiments, the entirety of the length of the isolation wall 116 may contact the IC package such that the contacts of the first differential arrangement 118 and the contacts of the second differential arrangement 120 may be completely isolated from each other by the isolation wall 116 and the IC package. In other embodiments, a portion of the length of the isolation wall 116 may contact the IC package, wherein a space between the isolation wall 116 and the IC package may be minimal to minimize areas between the contacts of the first differential arrangement 118 and the second differential arrangement 120 that are not isolated by the isolation wall 116 or the IC package.

The isolation wall 116 may include a conductive material. The isolation wall 116 may comprise the conductive material, may include a non-conductive material with the conductive material extending along one or more surfaces of the non-conductive material, may include a non-conductive material with the conductive material interspersed within the non-conductive material, or some combinations thereof. In embodiments where the conductive material extends along the surface of the non-conductive material, the conductive material may be plated to one or more of the surfaces the non-conductive material. In some of these embodiments, the conductive material may be plated to the surfaces that abut the fourth indent l06d and the fifth indent l06e.

In some embodiments, the conductive material may be a conductive metal. The conductive metal may include silver, copper, gold, aluminum, molybden, zinc, nickel, or some combination thereof. Further, in some embodiments, the non-conductive material may be a plastic, such as a molded plastic. The plastic may include polyethylene, polymethyl pentane, polytetrafluoroethene, polyvinyl chloride, or some combination thereof.

The conductive material included within the isolation wall 116 may provide increased electrical isolation versus embodiments with isolation walls that do not include conductive material. In particular, the conductive material may reduce the risk of crosstalk between the first differential arrangement 118 and the second differential arrangement 120. The IC package may provide protection against crosstalk, such that the isolation wall 116 and the IC package may protect against crosstalk of the first differential arrangement 118 and the second differential arrangement 120 in both the horizontal and vertical directions from the contacts. The increased electrical isolation may allow the signals of the first differential arrangement 118 and the second differential arrangement 120 to operate at frequencies of greater than 20 gigahertz (GHz).

The connector 100 may include one or more isolation walls, wherein each of the isolation walls include one or more of the features of the isolation wall 116. The isolation walls may be located between differential arrangements of the connector 100. For example, an isolation wall may be located between each pair of adjacent differential arrangements of the connector 100. In some embodiments, the connector 100 may include a plurality of differential arrangements located at the first side 108 and/or the second side of the recess 102, wherein an isolation wall (such as the first isolation wall 116) is located between each of the differential arrangements. Further, one or more of the isolation walls may include and/or contact depopulated ground contact.

In some embodiments, one or more of the ground contacts (such as the first ground contact 112, the second ground contact 114, the third ground contact 122, and/or the fourth ground contact 128) may be omitted from the differential arrangements. In these embodiments, the isolation wall 116 may be located adjacent to one or more of the differential contacts (such as the first differential contact 109, the second differential contact 110, the third differential contact 124, and/or the fourth differential contact 126) of the differential arrangement. In some of these embodiments, additional features and/or measures may be implemented to reduce potential shorting risks, including, but not limited to, maintaining at least a minimum spacing between the isolation wall 116 and the differential contacts and/or limiting voltages on the differential contacts to below a certain maximum voltage.

The connector 100 may further include one or more walls 130 located between two or more of the indents 106 where the isolation walls are not located. The walls 130 may be located between the contacts located within the indents 106 and may provide separation between the indents 106. The walls 130 may omit the conductive material and may comprise non-conductive material.

The connector 100 may further include one or more wires 132. The wires 132 may couple to one or more of the contacts (including the first differential contact 109, the second differential contact 110, the third differential contact 124, the fourth differential contact 126, the first ground contact 112, the second ground contact 114, the third ground contact 122, and the fourth ground contact 128). The wires 132 may provide for transmission of signals among the connector 100 and other components within a computer device (such as the computer device 900 (Fig. 9)).

Figure 2 illustrates an example interface arrangement representation 200 of the connector 100 of Figure 1, according to various embodiments. The interface arrangement representation 200 includes a first side representation 202 and a second side representation 204. The first side representation 202 illustrates an interface arrangement that may be implemented at a first side of a recess (such as the first side 108 (Fig. 1) of a recess 102 (Fig. 1)) of the connector 100. The second side representation 204 illustrates an interface arrangement that may be implemented at a second side of a recess (such as second side of the recess 102) of a connector 100. In some embodiments, the connector 100 may include contacts and isolation walls arranged at the first side 108 of the recess 102 in accordance with the first side representation 102, contacts and isolation walls arranged at the second side of the recess 102 in accordance with the second side representation 204, or some combination thereof.

For brevity, only the first side representation 202 is described herein. It is to be understood that the second side representation 204 includes the same features and arrangement of features as the first side representation 202 mirrored about the recess 102.

The first side representation 202 may include a first ground contact 206. The first ground contact 206 may include one or more of the features of the first ground contact 112 (Fig. 1). The first ground contact 206 may be located within an indent of a connector, such as the third indent l06c (Fig. 1) of the connector 100.

The first side representation 202 may further include a first differential contact 208. The first differential contact 208 may include one or more of the features of the first differential contact 109 (Fig. 1). The first differential contact 208 may be located adjacent to the first ground contact 206. The first differential contact 208 may be located within a second indent of the connector adjacent to the first ground contact 206, such as the first indent l06a (Fig. 1) of the connector 100.

The first side representation 202 may further include a second differential contact 210. The second differential contact 210 may include one or more of the features of the second differential contact 110 (Fig. 1). The second differential contact 210 may be located adjacent to the first differential contact 208, wherein the first differential contact 208 may be located between the first ground contact 206 and the second differential contact 210. The second differential contact 210 may be located within a third indent of the connector adjacent to the first differential contact 208, such as the second indent l06b (Fig. 1) of the connector 100.

The first side representation 202 may further include a second ground contact 206. The second ground contact 212 may include one or more of the features of the second ground contact 114 (Fig. 1). The second ground contact 212 may be located adjacent to the second differential contact 210, wherein the second differential contact 210 may be located between the first differential contact 208 and the second ground contact 212. Accordingly, the first differential contact 208 and the second differential contact 210 may be located between the first ground contact 206 and the second ground contact 212. The second ground contact 212 may be located within a fourth indent of the connector adjacent to the second differential contact 210, such as the fourth indent l06d.

The first ground contact 206, the first differential contact 208, the second differential contact 210, and the second ground contact 212 may comprise a first differential arrangement 220, such as the first differential arrangement 118 (Fig. 1).

The first side representation 202 may include a first isolation wall 214. The first isolation wall 214 may include one or more of the features of the first isolation wall 116 (Fig. 1). The first isolation wall 214 may be located adjacent to the second ground contact 212, on an opposite side of the second contact 212 from the second differential contact 210.

The first side representation 202 may include a second differential arrangement 222. The second differential arrangement 222 may include one or more of the features of the first differential arrangement 220, including the arrangement of ground contacts and differential contacts. The second differential arrangement 222 may be located on an opposite side of the first isolation wall 214 from the first differential arrangement 220.

The first isolation wall 214 may provide electrical isolation between the first differential arrangement 220 and the second differential arrangement 222. The first isolation wall 214 may reduce the risk of crosstalk between the first differential arrangement 220 and the second differential arrangement 222. In particular, the first isolation wall 214 may include conductive material, which may reduce the risk of crosstalk.

The first side representation 202 may further include a second isolation wall 224. The second isolation wall 224 may include one or more of the features of the first isolation wall 116 (Fig. 1). The second isolation wall 224 may include and/or may contact a depopulated ground contact 226. The second isolation wall 224 may be located adjacent to the second differential arrangement 222 on an opposite side of the second differential arrangement 222 from the first isolation wall 214.

The first side representation 202 may include a third differential arrangement 228. The third differential arrangement 228 may include one or more of the features of the first differential arrangement 220, including the arrangement of ground contacts and differential contacts. The third differential arrangement 228 may be located on an opposite side of the second isolation wall 224 from the second differential arrangement 222 The second isolation wall 224 may provide electrical isolation between the second differential arrangement 222 and the third differential arrangement 228. The second isolation wall 224 may reduce the risk of crosstalk between the second differential arrangement 222 and the third differential arrangement 228. In particular, the second isolation wall 224 may include conductive material, which may reduce the risk of crosstalk.

The first side representation 202 may proceed with an arrangement of contacts and isolation walls in accordance with arrangement described above. In particular, the first side representation 202 may include a plurality of differential arrangements (such as the first differential arrangement 220, the second differential arrangement 222, and/or the third differential arrangement 228) with an isolation wall located between each of the differential arrangements. As shown in the illustrated embodiment, every other isolation wall may include a depopulated ground contact (such as the depopulated ground contact 226). In other embodiments, more or less than every other isolation wall may include a depopulated ground contact. In other embodiments, none of the isolation walls may include a depopulated ground contact.

Figure 3 illustrates another example connector 300, according to various embodiments. The connector 300 may mate to an IC package. In particular, the connector 300 may include a housing 302 that receives a portion of the IC package. The portion of the IC package may be a HFI diving board of the IC package, wherein the HFI diving board may include one or more pads that are to couple to one or more contacts of the connector 300 when the connector 300 is mated to the IC package.

The housing 302 may comprise an alligator-type or clamp-type housing, wherein a portion of the housing 302 may clamp onto the portion of the IC package. In the illustrated embodiment, the housing 302 may include a first clamp portion 304 and a second clamp portion 306. The first clamp portion 304 and the second clamp portion 306 may be coupled together via one or more fasteners 308. The fasteners 308 may cause the first clamp portion 304 and the second clamp portion 306 to move together or apart depending on the engagement of the fasteners 308. In particular, the fasteners 308 may include screws in the illustrated embodiment, wherein the first clamp portion 304 and the second clamp portion 306 are moved together or apart depending on the rotation of the screws. The first clamp portion 304 and the second clamp portion 306 may clamp onto the portion of the IC package when the first clamp portion 304 and the second clamp portion 306 are moved together, which may affix the connector 300 to the portion of the IC package and cause contacts of the connector 300 to contact pads of the IC package. In other embodiments, the housing 302 may be a friction-lock housing and may omit the first clamp portion 304 and the second clamp portion 306.

The housing 302 may have a recess 310 located between the first clamp portion 304 and the second clamp portion 306. The recess 310 may receive the portion of the IC package when the connector 300 is mated with the IC package. A height 312 of the recess 310 (measured from the first clamp portion 304 to the second clamp portion 306) may be adjustable based on the movement of the first clamp portion 304 and the second clamp portion 306. The height 312 of the recess 310 may be adjusted to the thickness of the portion of the IC package, wherein a portion of the first clamp portion 304 located at a first side 314 of the recess 310 and a portion of the second clamp portion 306 located at a second side 316 of the recess 310 may contact the portion of the IC package.

The connector 300 may include a first group of contacts 318 located along the first side 314 of the recess 310 and a second group of contacts 320 located along the second side 316 of the recess 310. The first group of contacts 318 may contact pads on a first side of the portion of the IC package and the second group of contacts 320 may contact pads on a second side of the portion of the IC package when the connector 300 is mated to the IC package.

The first group of contacts 318 may be coupled to the first clamp portion 304 and/or contacted by the first clamp portion 304 as the first clamp portion 304 is moved via the fastener 308. Further, the second group of contacts 320 may be coupled to the second clamp portion 306 and/or contacted by the second clamp portion 306 is moved via the fastener 308. As the first clamp portion 304 and the second clamp portion 306 are moved together with the portion of the IC package located within the recess 310, the first group of contacts 318 and the second group of contacts 320 may be moved, or pressure may be applied to the first group of contacts 318 and the second group of contacts 320, to cause the first group of contacts 318 to contact the first side of the portion of the IC package and the second group of contacts 320 to contact the second side of the portion of the IC package. In particular, the first group of contacts 318 and the second group of contacts 320 may be moved toward the portion of IC package in directions perpendicular to the respective side of the IC package, which may minimize horizontal force upon the first group of contacts 318 and the second group of contacts 320 that may cause damage to the contacts. The first group of contacts 318 and the second group of contacts 320 are described further in Figures 5-7.

The connector 300 may further include one or more wires 322. The wires 322 may couple to one or more of the contacts (including the first group of contacts 318 and the second group of contacts 320). The wires 322 may provide for transmission of signals among the connector 300 and other components within a computer device (such as the computer device 900 (Fig. 9)).

Figure 4 illustrates a perspective view of an example contact arrangement 400 of the connector 300 of Figure 3, according to various embodiments. In particular, the contact arrangement 400 illustrates an embodiment of the arrangement of the first group of contacts 318 and the second group of contacts 320. For brevity, the first group of contacts 318 are described herein. It is to be understood that the second group of contacts 320 includes the same features and the same arrangement of features as the first group of contacts 318 mirrored about the recess 310 (Fig. 3).

The first group of contacts 318 may include a plurality of contacts arranged in a row along the first side 314 (Fig. 3) of the recess 310. The first group of contacts 318 may include a first differential contact 402 and a second differential contact 404. The second differential contact 404 may be located adjacent to the first differential contact 402 in a first direction. The first differential contact 402 may contact a first pad of the portion of the IC package when the connector 300 is mated to the IC package. The first pad may be coupled to a first signal of a differential pair of the IC package. Further, the second differential contact 404 may contact a second pad of the portion of the IC package when the connector 300 is mated to the IC package. The second pad may be coupled to a second signal of the differential pair of the IC package. The first differential contact 402 and the second differential contact 404 may comprise a first set of contacts 408.

The first group of contacts 318 may further include a first ground contact 406. The first ground contact 406 may be located adjacent to the first differential contact 402 in the first direction, wherein the first ground contact 406 is located on an opposite side of the first differential contact 402 from the second differential contact 404. In some embodiments, an entirety of the first ground contact 406 may be located adjacent to the first differential contact 402. The first ground contact 406 may contact a third pad of the portion of the IC package when the connector 300 is mated to the IC package. The third pad may be coupled to a ground of the IC package. The first ground contact 406 may include a first portion 410 and a second portion 412. The first portion 410 may be approximately planar (within one centimeter) with the first set of contacts 408. Further, a width of the first portion 410 may extend at approximately (within five degrees) of the first direction.

The second portion 412 of the first ground contact 406 may be connected to the first portion 410. The second portion 412 may be connected to the first portion 410 at a side of the first portion 410 opposite from the first set of contacts 408. A width of the second portion 412 may extend in a second direction, wherein the second direction is different than the first direction. In some embodiments, the width of the second portion 412 may be less than 0.3 millimeters. The width of the second portion 412 may extend toward the first side 314 of the recess 310. In some embodiments, the second direction may be approximately (within five degrees) perpendicular to the first direction. In these embodiments, the first portion 410 and the second portion 412 may form an L-shape.

The first ground contact 406 may further include a slanted portion 414. The slanted portion 414 may be located at an end of the first portion 410 opposite to where the first ground contact 406 contacts the housing 302. The slanted portion 414 may extend from the first portion 410 toward the first side 314 of the recess 310. In some

embodiments, the slanted portion 414 may have a length of less than 0.3 millimeters. The slanted portion 414 may contact the portion of the IC package as the IC package is being received by the connector 300 and may guide the portion of the IC package between the first group of contacts 318 and the second group of contacts 320. In some embodiments, the slanted portion 414 may be omitted.

The first ground contact 406 may provide electrical isolation for the first set of contacts 408. In particular, the first ground contact 406 may reduce the risk of crosstalk from other contacts on an opposite side of the first ground contact 406 from the first set of contacts 408. The second portion 412 of the first ground contact 406 may provide additional reduction of risk of crosstalk in the first direction, which may not be provided by legacy connectors.

The first group of contacts 318 may further include a second ground contact 416. The second ground contact 416 may include one or more of the features of the first ground contact 406. The second ground contact 416 may be located adjacent to the second differential contact 404 and on an opposite side of the first set of contacts 408 from the first ground contact 406. The second ground contact 416 may be a mirror image of the first ground contact 406, mirrored about the first set of contacts 408. The arrangement of the first ground contact 406, the first differential contact 402, the second differential contact 404, and the second ground contact 416 may be referred to as a first differential arrangement 420.

The second ground contact 416 may provide electrical isolation for the first set of contacts 408. In particular, the second ground contact 416 may reduce the risk of crosstalk from other contacts on an opposite side of the second ground contact 416 from the first set of contacts 408. A second portion 418 of the second ground contact 416, which extends in a second direction that is different than the first direction, may provide additional reduction of risk of crosstalk in the first direction, which may not be provided by legacy connectors. Further, the IC package may provide electrical isolation from crosstalk when mated with the connector 300. Accordingly, the first set of contacts 408 may be shielded from crosstalk in both the horizontal and vertical directions by the combination of the IC package, the first ground contact 406, and the second ground contact 416.

The first group of contacts 318 may further include one or more additional differential arrangements, wherein the additional differential arrangements are located adjacent to the first differential arrangement 420. For example, a second differential arrangement 422 may be located adjacent to the first differential arrangement 420. The second differential arrangement 422 may include one or more of the features of the first differential arrangement 420. The differential contacts of the second differential arrangement 420 may couple to a different differential pair of the IC package than the differential pair coupled to the differential contacts of the first differential arrangement 420. The second ground contact 416 of the first differential arrangement 420 and a ground contact 424 of the second differential arrangement 422 may reduce the risk of crosstalk between the first differential arrangement 420 and the second differential arrangement 422. For example, the second ground contact 416 and the ground contact 424 may prevent, or at least reduce, the risk of crosstalk of differential pair signals having frequencies above 20 GHz.

Figure 5 illustrates a top view of the example contact arrangement 400 of Figure 4, according to various embodiments. In particular, the top view of the first group of contacts 318 is illustrated.

The first group of contacts 318 may include the first differential arrangement 420 and a second differential arrangement 422. The second differential arrangement 422 may be located adjacent to the first differential arrangement 420. The first differential arrangement 420 may include the first differential contact 402, the second differential contact 404, the first ground contact 406, and the second ground contact 416.

Figure 6 illustrates end views of an example contact arrangements, according to various embodiments. In particular, a first contact arrangement 600 and a second contact arrangement 650 are illustrated. The first contact arrangement 600, the second contact arrangement 650, portions thereof, or some combination thereof may be implemented in a connector, such as the connector 300 (Fig. 3).

The first contact arrangement 600 may include a first differential contact 602 and a second differential contact 604. The first differential contact 602 and the second differential contact 604 may each include one or more of the features of the first differential contact 402 (Fig. 4) and/or the second differential contact 404 (Fig. 4). The second differential contact 604 may be located adjacent to the first differential contact 602 in a first direction. The first differential contact 602 and the second differential contact 604 may couple to a differential pair of an IC package.

The first contact arrangement 600 may further include a first ground contact 606 and the second ground contact 608. The first ground contact 606 and the second ground contact 608 may each include one or more of the features of the first ground contact 406 (Fig. 4) and/or the second ground contact 416 (Fig. 4). The first ground contact 606 may be located adjacent to the first differential contact 602. The first ground contact 606 may be located on a side of the first differential contact 602 opposite from the second differential contact 602.

The first ground contact 606 may include a first portion 610 and a second portion 612. A width of the first portion 610 may extend approximately (within five degrees) in the first direction. The first portion 610 may be approximately (within 1 centimeter) planar with the first differential contact 602 and the second differential contact 604.

The second portion 612 may be located at an opposite side of the first portion 610 from the first differential contact 602. A width of the second portion 612 may extend in a second direction, wherein the second direction is different than the first direction. In the illustrated embodiment, the width of the second portion 612 may extend approximately (within five degrees) perpendicular to the first portion 610. The first portion 610 and the second portion 612 of the first ground contact 606 may form an L-shape. The width of the second portion 612 may be less than 0.3 millimeters. The second ground contact 608 may include the same features as the first ground contact 606. In particular, the second ground contact 608 may be a mirror image of the first ground contact 606 mirrored about the first differential contact 602 and the second differential contact 604.

The second contact arrangement 650 may include one or more differential arrangements. In particular, the second contact arrangement 650 is illustrated within a first differential arrangement 652, a second differential arrangement 654, a third differential arrangement 656, and a fourth differential arrangement 658 aligned in a row. The first differential arrangement 652, the second differential arrangement 654, the third differential arrangement 656, and the fourth differential arrangement 658 may include one or more of the same features. For brevity, only the first differential arrangement 652 is described herein.

The first differential arrangement 652 may include a first differential contact 660 and a second differential contact 662. The first differential contact 660 and the second differential contact 662 may each include one or more of the features of the first differential contact 402 and/or the second differential contact 404. The second differential contact 662 may be located adjacent to the first differential contact 660 in a first direction. The first differential contact 660 and the second differential contact 660 may couple to a differential pair of an IC package.

The first differential arrangement 652 may further include a first ground contact 664 and a second ground contact 666. The first ground contact 664 and the second ground contact 666 may each include one or more of the features of the first ground contact 406 and/or the second ground contact 416. The first ground contact 664 may be located adjacent to the first differential contact 660. The first ground contact 664 may be located on a side of the first differential contact 660 opposite from the second differential contact 662.

The first ground contact 664 may include a first portion 668 and a second portion 670. The first ground contact 664 may further include a curved portion 672, which may connect the first portion 668 and the second portion 670. A width of the first portion 668 may extend approximately (within five degrees) in the first direction.

The second portion 670 may be located at an opposite side of the first portion 668 from the first differential contact 660. The curved portion 672 may be located between the first portion 668 and the second portion 670. A width of the second portion 670 may extend in a second direction, wherein the second direction is different than the first direction. In the illustrated embodiment, the width of the second portion 670 may extend approximately (within five degrees) perpendicular to the first portion 668. The first portion 610 and the second portion 612 of the first ground contact 606 may form an L- shape. The width of the second portion 670 and/or the curved portion 672 may be less than 0.3 millimeters.

The second ground contact 666 may include the same features as the first ground contact 664. In particular, the second ground contact 666 may be a mirror image of the first ground contact 664 mirrored about the first differential contact 660 and the second differential contact 662.

Figure 7 illustrates another example connector 700, according to various embodiments. The connector 700 may include one or more of the features of the connector 300 (Fig. 3). The connector 700 may mate to an IC package. In particular, the connector 700 may include a housing 702 that receives a portion of the IC package. The portion of the IC package may be a HFI diving board of the IC package, wherein the HFI diving board may include one or more pads that are to couple to one or more contacts of the connector 700 when the connector 700 is mated to the IC package.

The housing 702 may have a recess 704. The recess 704 may receive the portion of the IC package when the connector 700 is mated with the IC package. The recess 704 may include a first side 706 and a second side 708. The second side 708 of the recess 704 may be located on an opposite side of the recess 704 from the first side 706.

The connector 700 may include a first group of contacts 710 located along the first side 706 of the recess 704 and a second group of contacts 712 located along the second side 708 of the recess 704. The first group of contacts 710 may contact pads on a first side of the portion of the IC package and the second group of contacts 712 may contact pads on a second side of the portion of the IC package when the connector 700 is mated to the IC package. The first group of contacts 710 and the second group of contacts 712 are described further in Figure 8.

The connector 700 may further include one or more wires 714. The wires 714 may couple to one or more of the contacts (including the first group of contacts 710 and the second group of contacts 712). The wires 714 may provide for transmission of signals among the connector 700 and other components within a computer device (such as the computer device 900 (Fig. 9)). Figure 8 illustrates a perspective view of an example contact arrangement 800 that may be implemented by the connector 700 of Figure 7, according to various embodiments. In particular, the contact arrangement 800 illustrates an embodiment of the arrangement of the first group of contacts 832 and the second group of contacts 834. The first group of contacts 832 may be implemented in place of the first group of contacts 710 (Fig. 7) and the second group of contacts 834 may be implemented in place of the second group of contacts 712 (Fig. 7). For brevity, the second group of contacts 834 are described herein.

It is to be understood that the first group of contacts 832 includes the same features and the same arrangement of features as the second group of contacts 834 mirrored about a recess (such as the recess 704 (Fig. 7)) of the connector 700.

The second group of contacts 834 may include a plurality of contacts arranged in a row along a second side (such as the second side 708 (Fig. 7)) of the recess. The second group of contacts 834 may include a first differential contact 802 and a second differential contact 804. The second differential contact 804 may be located adjacent to the first differential contact 802 in a first direction. The first differential contact 802 may contact a first pad of the portion of the IC package when the connector 700 is mated to the IC package. The first pad may be coupled to a first signal of a differential pair of the IC package. Further, the second differential contact 804 may contact a second pad of the portion of the IC package when the connector 700 is mated to the IC package. The second pad may be coupled to a second signal of the differential pair of the IC package. The first differential contact 802 and the second differential contact 804 may comprise a first set of contacts 806.

The first differential contact 802 and the second differential contact 804 may comprise a reverse contact design. For brevity, the reverse contact design is described herein in reference to the first differential contact 802. It is to be understood that the second differential contact 804 may include the same features of the reverse contact design.

In regards to the reverse contact design, the first differential contact 802 may include a tip 807 that loops back in a direction opposite to an extension of a main body 808 of the first differential contact 802. In particular, the main body 808 of the first differential contact 802 may extend from a housing 830. The housing 830 may include one or more of the features of the housing 702 (Fig. 7). The tip 807 may be located at an end of the main body 808 and may curve back toward the housing 830. The tip 807 may curve back in the direction at which the portion of the IC package is to be received in the connector 700. A portion of the tip 807 may contact the pad of the IC package when the connector 700 is mated with the IC package. An end 810 of the tip 807 that loops back may contact the main body 808 and may remain in contact with the main body 808 when the connector 700 is mated with the IC package. In some embodiments, the end 810 of the tip may be affixed to the main body 808, such as via solder, electrically-conductive epoxy, a clamp procedure, or some combination thereof.

In the illustrated embodiment, the first differential contact 802 is illustrated as a reverse contact design without an offset. In particular, the main body 808 may extend from the housing 830 approximately (within five degrees) perpendicular to the housing and the tip 807 may initially extend straight from the main body 808. In other embodiments, the first differential contact 802 may include a reverse contact design with an offset. In these embodiments, the main body 808 may extend from the housing 830 at an angle to the housing 830 and the tip 807 may initially extend at an angle from the main body 808.

The reverse contact design of the first differential contact 802 may provide two conduction paths from the contact of the tip 807 with the pad of the IC package to the housing 830. In particular, a first path may be from the contact of the tip 807 with the pad of the IC package through the loop formed by the tip 807 and the main body 808. A second path may be from the contact of the tip 807 through the end 810 of the tip 807 that is in contact with the main body 808 and through the main body 808.

The two paths may cause the first differential contact 802 to have a stub length of effectively zero. By having a stub length of effectively zero, the first differential contact 802 may not experience, or may experience reduced amounts of, signal degradation. In particular, having the stub length of effectively zero may provide improved time domain reflectometry impedance profile and improved insertion loss.

The second group of contacts 834 may further include a first ground contact 812. The first ground contact 812 may be located adjacent to the second differential contact 804 in the first direction, wherein the first ground contact 812 is located on an opposite side of the second differential contact 804 from the first differential contact 802. In some embodiments, an entirety of the first ground contact 812 may be located adjacent to the second differential contact 804. The first ground contact 812 may contact a third pad of the portion of the IC package when the connector 700 is mated to the IC package. The third pad may be coupled to a ground of the IC package.

The first ground contact 812 may include a first portion 814 and a second portion 816. The first portion 814 may be approximately planar (within one centimeter) with the first set of contacts 806. Further, a width of the first portion 814 may extend

approximately (within five degrees) in the first direction.

The second portion 816 of the first ground contact 812 may be connected to the first portion 814. The second portion 816 may be connected to the first portion 814 at a side of the first portion 814 opposite from the first set of contacts 806. A width of the second portion 816 may extend in a second direction, wherein the second direction is different than the first direction. In some embodiments, the width of the second portion 816 may be less than 0.3 millimeters. The width of the second portion 816 may extend toward the second side 708 of the recess 704. In some embodiments, the second direction may be approximately (within five degrees) perpendicular to the first direction. In these embodiments, the first portion 814 and the second portion 816 may form an L-shape.

The first ground contact 812 may further include a slanted portion 818. The slanted portion 818 may be located at an end of the first portion 814 opposite to where the first ground contact 812 contacts the housing 830. The slanted portion 818 may extend from the first portion 812 toward the second side 708 of the recess 704. In some embodiments, the slanted portion 818 may have a length of less than 0.3 millimeters. The slanted portion 818 may contact the portion of the IC package as the IC package is being received by the connector 700 and may guide the portion of the IC package between the first group of contacts 832 and the second group of contacts 834. In some embodiments, the slanted portion 818 may be omitted as illustrated in Figure 7.

The first ground contact 812 may provide electrical isolation for the first set of contacts 806. In particular, the first ground contact 812 may reduce the risk of crosstalk from other contacts on an opposite side of the first ground contact 812 from the first set of contacts 806. The second portion 816 of the first ground contact 812 may provide additional reduction of risk of crosstalk in the first direction, which may not be provided by legacy connectors.

The first group of contacts 832 may further include a second ground contact 820. The second ground contact 820 may include one or more of the features of the first ground contact 812. The second ground contact 820 may be located adjacent to the first differential contact 802 and on an opposite side of the first set of contacts 806 from the first ground contact 812. The second ground contact 820 may be a mirror image of the first ground contact 812, mirrored about the first set of contacts 806. The arrangement of the first ground contact 812, the first differential contact 802, the second differential contact 804, and the second ground contact 820 may be referred to as a first differential arrangement 822.

The second ground contact 820 may provide electrical isolation for the first set of contacts 806. In particular, the second ground contact 820 may reduce the risk of crosstalk from other contacts on an opposite side of the second ground contact 820 from the first set of contacts 806. A second portion 824 of the second ground contact 820, which extends in a second direction that is different than the first direction, may provide additional reduction of risk of crosstalk in the first direction, which may not be provided by legacy connectors. Further, the IC package may provide electrical isolation from crosstalk when mated with the connector 700. Accordingly, the first set of contacts 806 may be shielded from crosstalk in both the horizontal and vertical directions by the combination of the IC package, the first ground contact 812, and the second ground contact 820.

The first group of contacts 806 may further include one or more additional differential arrangements, wherein the additional differential arrangements are located adjacent to the first differential arrangement 822. For example, a second differential arrangement 826 may be located adjacent to the first differential arrangement 822. The second differential arrangement 826 may include one or more of the features of the first differential arrangement 822. The differential contacts of the second differential arrangement 826 may couple to a different differential pair of the IC package than the differential pair coupled to the differential contacts of the first differential arrangement 822. The second ground contact 820 of the first differential arrangement 822 and a ground contact 828 of the second differential arrangement 826 may reduce the risk of crosstalk between the first differential arrangement 822 and the second differential arrangement 826. For example, the second ground contact 820 and the ground contact 828 may prevent, or at least reduce, the risk of crosstalk of differential pair signals having frequencies above 20 GHz.

Figure 9 illustrates an example computer device 900 that may employ the apparatuses and/or methods described herein (e.g., the connector 100, the connector 300, and/or the connector 700), in accordance with various embodiments. As shown, computer device 900 may include a number of components, such as one or more processor(s) 904 (one shown) and at least one communication chip 906. In various embodiments, the one or more processor(s) 904 each may include one or more processor cores. In various embodiments, the at least one communication chip 906 may be physically and electrically coupled to the one or more processor(s) 904. In further implementations, the

communication chip 906 may be part of the one or more processor(s) 904. In various embodiments, computer device 900 may include printed circuit board (PCB) 902. For these embodiments, the one or more processor(s) 904 and communication chip 906 may be disposed thereon. In alternate embodiments, the various components may be coupled without the employment of PCB 902.

Depending on its applications, computer device 900 may include other components that may or may not be physically and electrically coupled to the PCB 902. These other components include, but are not limited to, memory controller 926, volatile memory (e.g., dynamic random access memory (DRAM) 920), non-volatile memory such as read only memory (ROM) 924, flash memory 922, storage device 954 (e.g., a hard-disk drive (HDD)), an I/O controller 941, a digital signal processor (not shown), a crypto processor (not shown), a graphics processor 930, one or more antenna 928, a display (not shown), a touch screen display 932, a touch screen controller 946, a battery 936, an audio codec (not shown), a video codec (not shown), a global positioning system (GPS) device 940, a compass 942, an accelerometer (not shown), a gyroscope (not shown), a speaker 950, a camera 952, and a mass storage device (such as hard disk drive, a solid state drive, compact disk (CD), digital versatile disk (DVD)) (not shown), and so forth.

In some embodiments, the one or more processor(s) 904, flash memory 922, and/or storage device 954 may include associated firmware (not shown) storing programming instructions configured to enable computer device 900, in response to execution of the programming instructions by one or more processor(s) 904, to practice all or selected aspects of the methods described herein. In various embodiments, these aspects may additionally or alternatively be implemented using hardware separate from the one or more processor(s) 904, flash memory 922, or storage device 954.

The communication chips 906 may enable wired and/or wireless communications for the transfer of data to and from the computer device 900. The term“wireless” and its derivatives may be used to describe circuits, devices, systems, methods, techniques, communications channels, etc., that may communicate data through the use of modulated electromagnetic radiation through a non-solid medium. The term does not imply that the associated devices do not contain any wires, although in some embodiments they might not. The communication chip 906 may implement any of a number of wireless standards or protocols, including but not limited to IEEE 802.20, Long Term Evolution (LTE), LTE Advanced (LTE-A), General Packet Radio Service (GPRS), Evolution Data Optimized (Ev-DO), Evolved High Speed Packet Access (HSPA+), Evolved High Speed Downlink Packet Access (HSDPA+), Evolved High Speed Uplink Packet Access (HSUPA+), Global System for Mobile Communications (GSM), Enhanced Data rates for GSM Evolution (EDGE), Code Division Multiple Access (CDMA), Time Division Multiple Access (TDMA), Digital Enhanced Cordless Telecommunications (DECT), Worldwide

Interoperability for Microwave Access (WiMAX), Bluetooth, derivatives thereof, as well as any other wireless protocols that are designated as 3G, 4G, 5G, and beyond. The computer device 900 may include a plurality of communication chips 906. For instance, a first communication chip 906 may be dedicated to shorter range wireless communications such as Wi-Fi and Bluetooth, and a second communication chip 906 may be dedicated to longer range wireless communications such as GPS, EDGE, GPRS, CDMA, WiMAX, LTE, Ev-DO, and others.

The computer device 900 may further include a connector 960. The connector 960 may include one or more of the features of the connector 100 (Fig. 1), the connector 300 (Fig. 3), the connector 700 (Fig. 7), or some combination thereof. In the illustrated embodiment, the connector 960 is illustrated mated with the processor 904. In particular, the connector 960 may mate with a diving board of the processor 904. Further, the connector 960 may couple the processor 904 to the communication chip 906. It is to be understood that the connector 960 may mate to a diving board of any of the other components within the computer device 900 and may couple to any of the other components within the computer device 900.

In various implementations, the computer device 900 may be a laptop, a netbook, a notebook, an ultrabook, a smartphone, a computer tablet, a personal digital assistant (PDA), an ultra-mobile PC, a mobile phone, a desktop computer, a server, a printer, a scanner, a monitor, a set-top box, an entertainment control unit (e.g., a gaming console or automotive entertainment unit), a digital camera, an appliance, a portable music player, or a digital video recorder. In further implementations, the computer device 900 may be any other electronic device that processes data.

Figure 10 illustrates an example computer device 1000 that may employ the apparatuses and/or methods described herein (e.g., the connector 100, the connector 300, and/or the connector 700), in accordance with various embodiments. As shown, computer device 1000 may include a number of components, such as one or more processor and memory controller device(s) 1004 (one shown) and at least one communication chip 1006. In various embodiments, the one or more processor and memory controller device(s) 1004 each may include one or more processor cores. In various embodiments, the at least one communication chip 1006 may be physically and electrically coupled to the one or more processor and memory controller device(s) 1004. In further implementations, the communication chip 1006 may be part of the one or more processor and memory controller device(s) 1004.

Further, in various embodiments, a system management device 1030 (such as baseboard management controller (BMC)) may be coupled to the one or more processor and memory controller device(s) 1004. The system management device 1030 may monitor the state of the computer device 1000 via one or more sensors 1060. The one or more sensors 1060 may sense the physical state of the computer device 1000, such as a temperature of the computer device 1000. In some embodiments, the system management device 1030 may communicate with the one or more processor and memory controller device(s) 1004 through an independent connection. Further, in some embodiments, the system management device 1030 and/or the sensors 1060 may be omitted.

In various embodiments, computer device 1000 may include printed circuit board (PCB) 1002. For these embodiments, the one or more processor and memory controller device(s) 1004 and communication chip 1006 may be disposed thereon. In alternate embodiments, the various components may be coupled without the employment of PCB 1002. Depending on its applications, computer device 1000 may include other components that may or may not be physically and electrically coupled to the PCB 1002. These other components include, but are not limited to, main memory (e.g., volatile memory, non-volatile memory, and/or dynamic random access memory (DRAM) 1020), read-only memory (ROM) 1024, flash memory 1022, storage device 1054 (e.g., a hard disk drive (HDD)), an I/O controller 1041, a digital signal processor (not shown), a crypto processor (not shown), a system management device 1030, a display (not shown), a power conversion device 1036, an audio codec (not shown), a video codec (not shown), and a mass storage device (such as hard disk drive, a solid state drive, compact disk (CD), digital versatile disk (DVD)) (not shown), and so forth. In various embodiments, the computer device 1000 may include one or more fans 1040. The one or more fans 1040 may be directed at and/or mounted to one or more of the components within the computer device 1000. In some embodiments, the one or more fans 1040 may be coupled to the one or more processor and memory controller device(s) 1004 and/or the system management device 1030, which may control operation of the one or more fans 1040.

In some embodiments, the one or more processor and memory controller device(s) 1004, flash memory 1022, and/or storage device 1054 may include associated firmware (not shown) storing programming instructions configured to enable computer device 1000, in response to execution of the programming instructions by one or more processor and memory controller device(s) 1004, to practice all or selected aspects of the methods described herein. In various embodiments, these aspects may additionally or alternatively be implemented using hardware separate from the one or more processor and memory controller device(s) 1004, flash memory 1022, or storage device 1054.

The computer device 1000 may further include a connector 1056. The connector 1056 may include one or more of the features of the connector 100 (Fig. 1), the connector 300 (Fig. 3), and/or the connector 700 (Fig. 7), or some combination thereof. In the illustrated embodiment, the connector 1056 is illustrated mated with the one or more processor and memory controller device(s) 1004. In particular, the connector 1056 may mate with one of the processor and memory controller device(s) 1004. For example, the connector 1056 may mate with a diving board of the one of the processor and memory controller device(s). Further, the connector 1056 may couple the one of the processor and memory controller device(s) 1004 to the communication chip 1006. It is to be understood that the connector 1056 may mate to a diving board of any of the other components within the computer device 1000 and may couple to any of the other components within the computer device 1000.

The communication chips 1006 may enable wired and/or wireless communications for the transfer of data to and from the computer device 1000. The term“wireless” and its derivatives may be used to describe circuits, devices, systems, methods, techniques, communications channels, etc., that may communicate data through the use of modulated electromagnetic radiation through a non-solid medium. The term does not imply that the associated devices do not contain any wires, although in some embodiments they might not. The communication chip 1006 may implement any of a number of wireless standards or protocols, including but not limited to IEEE 1002.20, Long Term Evolution (LTE),

LTE Advanced (LTE-A), General Packet Radio Service (GPRS), Evolution Data

Optimized (Ev-DO), Evolved High Speed Packet Access (HSPA+), Evolved High Speed Downlink Packet Access (HSDPA+), Evolved High Speed Uplink Packet Access

(HSUPA+), Global System for Mobile Communications (GSM), Enhanced Data rates for GSM Evolution (EDGE), Code Division Multiple Access (CDMA), Time Division Multiple Access (TDMA), Digital Enhanced Cordless Telecommunications (DECT), Worldwide Interoperability for Microwave Access (WiMAX), Bluetooth, derivatives thereof, as well as any other wireless protocols that are designated as 3G, 4G, 5G, and beyond. The computer device 1000 may include a plurality of communication chips 1006. For instance, a first communication chip 1006 may be dedicated to shorter range wireless communications such as Wi-Fi and Bluetooth, and a second communication chip 1006 may be dedicated to longer range wireless communications such as GPS, EDGE, GPRS, CDMA, WiMAX, LTE, Ev-DO, and others.

In various implementations, the computer device 1000 may be a server. In other implementations, the computer device 1000 may be, or components of the computer device 1000 may be implemented in, a laptop, a netbook, a notebook, an ultrabook, a smartphone, a computer tablet, a personal digital assistant (PDA), an ultra-mobile PC, a mobile phone, a desktop computer, a printer, a scanner, a monitor, a set-top box, an entertainment control unit (e.g., a gaming console or automotive entertainment unit), a digital camera, an appliance, a portable music player, or a digital video recorder. In further implementations, the computer device 1000 may be any other electronic device that processes data.

Example 1 may include a connector for mating with an integrated circuit (IC) package, comprising a first set of contacts to couple to a first differential pair of the IC package, a second set of contacts to couple to a second differential pair of the IC package, and an isolation wall located between the first set of contacts and the second set of contacts, the isolation wall to provide electrical isolation between the first set of contacts and the second set of contacts, wherein the isolation wall includes a conductive material.

Example 2 may include the connector of example 1, further comprising a first ground contact to be coupled to a ground of the IC package, the first ground contact located between the first set of contacts and the isolation wall, and a second ground contact to be coupled to the ground of the IC package, the second ground contact located between the second set of contacts and the isolation wall.

Example 3 may include the connector of examples 1 or 2, further comprising a housing with a recess, the recess to receive a portion of the IC package, wherein the first set of contacts, the second set of contacts, and the isolation wall are located within the recess and are to contact the portion of the IC package.

Example 4 may include the connector of example 3, wherein the portion of the IC package includes a diving board of a central processing unit package.

Example 5 may include the connector of examples 1 or 2, wherein the conductive material is a conductive metal.

Example 6 may include the connector of examples 1 or 2, wherein the isolation wall further includes plastic, and wherein the conductive material is interspersed within the plastic or plated on an exterior of the plastic.

Example 7 may include a computer device, comprising an integrated circuit (IC) package, the IC package having a diving board, and a connector mated with the diving board, the connector including a first set of contacts coupled to a first differential pair of the IC package, a second set of contacts coupled to a second differential pair of the IC package, and an isolation wall located between the first set of contacts and the second set of contacts, the isolation wall to provide electrical isolation between the first set of contacts and the second set of contacts, wherein the isolation wall includes a conductive material.

Example 8 may include the computer device of example 7, wherein the isolation wall contacts the diving board.

Example 9 may include the computer device of examples 7 or 8, further comprising a first ground contact mated to a ground of the IC package, the first ground contact located between the first set of contacts and the isolation wall, and a second ground contact mated to the ground of the IC package, the second ground contact located between the second set of contacts and the isolation wall.

Example 10 may include the computer device of examples 7 or 8, wherein the connector further includes a housing with a recess, wherein the diving board extends into the recess, and wherein the first set of contacts, the second set of contacts, and the isolation wall are located within the recess and contact the diving board.

Example 11 may include the computer device of examples 7 or 8, wherein the conductive material is a conductive metal. Example 12 may include the computer device of examples 7 or 8, wherein the isolation wall further includes plastic, and wherein the conductive material is interspersed within the plastic or plated on an exterior of the plastic.

Example 13 may include a connector for mating with an integrated circuit (IC) package, comprising a set of contacts to couple to a differential pair of the IC package, the set of contacts including a first contact and a second contact, the second contact located adjacent to the first contact in a first direction, and a ground contact located adjacent to the set of contacts in the first direction and to be coupled to a ground of the IC package, wherein a portion of the ground contact extends in a second direction, the second direction being different than the first direction.

Example 14 may include the connector of example 13, wherein the ground contact is L-shaped.

Example 15 may include the connector of examples 13 or 14, wherein the portion of the ground contact is a first portion of the ground contact, and wherein a second portion of the ground contact is planar with the set of contacts and extends in the first direction.

Example 16 may include the connector of examples 13 or 14, wherein the set of contacts is a first set of contacts and the differential pair is a first differential pair, wherein the connector further includes a second set of contacts to couple to a second differential pair of the IC package, and wherein the ground contact is located between the first set of contacts and the second set of contacts.

Example 17 may include the connector of examples 13 or 14, further comprising a housing with a recess, the recess to receive a portion of the IC package, wherein the set of contacts and the ground contact are located within the recess and are to contact the portion of the IC package.

Example 18 may include a computer device, comprising an integrated circuit (IC) package, the IC package having a diving board and a connector mated with the diving board, the connector including a set of contacts coupled to a differential pair of the IC package, the set of contacts including a first contact and a second contact, the second contact located adjacent to the first contact in a first direction, and a ground contact located adjacent to the set of contacts in the first direction and coupled to a ground of the IC package, wherein a portion of the ground contact extends in a second direction, the second direction being different than the first direction.

Example 19 may include the computer device of example 18, wherein the second direction is perpendicular to the first direction.

Example 20 may include the computer device of examples 18 or 19, wherein a first portion of the ground contact is planar with the set of contacts and extends in the first direction, and wherein a second portion of the ground contact extends in the second direction.

Example 21 may include the computer device of example 20, wherein the first portion of the ground contact contacts a pad of the IC package, and wherein the second portion of the ground contact extends away from the diving board in the second direction.

Example 22 may include the computer device of example 20, wherein the second portion of the ground contact is located at an opposite side of the first portion of the ground contact from the set of contacts.

Example 23 may include the computer device of examples 18 or 19, wherein the set of contacts is a first set of contacts and the differential pair is a first differential pair, wherein the connector further includes a second set of contacts coupled to a second differential pair of the IC package, and wherein the ground contact is located between the first set of contacts and the second set of contacts.

Example 24 may include the computer device of examples 18 or 19, wherein the diving board includes a pad coupled to the ground of the IC package, and wherein the ground contact contacts the pad.

Example 25 may include the computer device of example 24, wherein an end of the ground contact is in contact with the pad.

It will be apparent to those skilled in the art that various modifications and variations can be made in the disclosed embodiments of the disclosed device and associated methods without departing from the spirit or scope of the disclosure. Thus, it is intended that the present disclosure covers the modifications and variations of the embodiments disclosed above provided that the modifications and variations come within the scope of any claims and their equivalents.