Title:
CONTACT STRUCTURE OF CAMERA MODULE AND ELECTRONIC APPARATUS COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2022/154317
Kind Code:
A1
Abstract:
An electronic apparatus according to various embodiments of the present disclosure may comprise: a rear plate comprising a recessed structure; a camera bracket which is arranged in the recessed structure and exposed to the outside, covers a camera assembly, and is connected to the rear plate; a printed circuit board arranged inside the electronic apparatus; a sealing member comprising a first portion arranged along the boundary portion of the rear plate and the camera bracket, a second portion extending toward the camera bracket from the first portion, and a third portion extending toward the rear plate from the first portion; a metal plate which is formed to surround at least part of the first portion of the sealing member and couples the rear plate and the bracket; and a conductive member electrically connecting the metal member and the printed circuit board.
Inventors:
JUNG YANGGYUN (KR)
PARK HONGCHUL (KR)
JANG BYUNGGUN (KR)
PARK HONGCHUL (KR)
JANG BYUNGGUN (KR)
Application Number:
PCT/KR2021/019932
Publication Date:
July 21, 2022
Filing Date:
December 27, 2021
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H04N5/225; H04M1/02; H05K1/18
Foreign References:
| KR20170003846A | 2017-01-10 | |||
| KR20180096178A | 2018-08-29 | |||
| KR20150142386A | 2015-12-22 | |||
| KR20160093563A | 2016-08-08 | |||
| KR100780204B1 | 2007-11-27 |
Attorney, Agent or Firm:
LEE, Keon-Joo et al. (KR)
Download PDF: