CONTACTLESS MULTILAYER FILM MEASUREMENT METHOD

WIPO Patent Application WO/2022/180830

A1

This invention is for contactlessly measuring a film thickness and refractive index in each step of a manufacturing process for forming a multilayer film. This contactless multilayer film measurement method for measuring physical property values of each film in a multilayer film formed on a substrate comprises: a step for acquiring first measurement results that have been obtained in a previous process and are the light intensities of laser light that has been emitted onto the surface of a first film and reflected from the surface; a step for acquiring second measurement results for a second film that has been formed in the current process; a step for calculating differences that are the differences between the second measurement results and first measurement results and the differences between reflection spectrums that have been determined from the light intensities of the reflected light and represent reflectivity in relation to wavelength; and a step for calculating the film thickness and a refractive index of the second film from the differences.

JP2001264021	APPARATUS AND METHOD, FOR MEASURING FLUID FILM THICKNESS
JPS6222006	MEASURING INSTRUMENT FOR FILM THICKNESS
JP2012220359	PROCESS MONITORING DEVICE USED FOR SUBSTRATE PROCESSING APPARATUS, PROCESS MONITORING METHOD, AND SUBSTRATE PROCESSING APPARATUS

OTA MASASHI (JP)
YAMAGUCHI KEITA (JP)
FUJIWARA YUJI (JP)
SUZUKI KENYA (JP)

PCT/JP2021/007513

September 01, 2022

February 26, 2021

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NIPPON TELEGRAPH & TELEPHONE (JP)

G01B11/06; G01N21/41

WO2011045967A1

2011-04-21

JP2005083834A	2005-03-31
JP2015232450A	2015-12-24

TANI & ABE, P.C. (JP)

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