Title:
CONTACTS AND TEST SOCKET APPARATUS FOR TESTING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/198853
Kind Code:
A1
Abstract:
The present invention relates to contacts and a socket apparatus for testing a semiconductor device. Each contact according to the present invention is a spring contact integrally formed by punching out and bending a metal plate, and comprises: an elastic part formed of various strips having certain patterns; and tip parts respectively provided on both ends of the elastic part. The volumetric space of a contact is preferably filled with a filler having conductivity and elasticity, such that the contact exhibits excellent durability and electrical characteristics. Also, the test socket according to the present invention is a rubber-type soket that employs said contact and is suitable for testing a device for fine pitches.
Inventors:
HWANG DONG WEON (KR)
HWANG JAE SUK (US)
HWANG JAE BAEK (KR)
HWANG JAE SUK (US)
HWANG JAE BAEK (KR)
Application Number:
PCT/KR2018/004617
Publication Date:
October 17, 2019
Filing Date:
April 20, 2018
Export Citation:
Assignee:
HWANG DONG WEON (KR)
HWANG JAE SUK (US)
HWANG JAE BAEK (KR)
HWANG JAE SUK (US)
HWANG JAE BAEK (KR)
International Classes:
G01R1/067; G01R1/04; G01R1/073; G01R3/00; G01R31/28
Foreign References:
| JP2016223996A | 2016-12-28 | |||
| KR20170108522A | 2017-09-27 | |||
| JP4921344B2 | 2012-04-25 | |||
| JP2013205191A | 2013-10-07 | |||
| KR101266123B1 | 2013-05-27 |
Attorney, Agent or Firm:
LEE, Un Cheol (KR)
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