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Patent Searching and Data


Title:
CONTAINER INCLUDING RFID MODULE
Document Type and Number:
WIPO Patent Application WO/2022/097422
Kind Code:
A1
Abstract:
This container including an RFID module comprises: an insulating base material which forms the outer shape of the container; a metal film formed on a first principal surface of the base material; and a slit formed in the metal film. The RFID module includes: an RFIC element; a filter circuit which transmits, to the RFIC element, current from electromagnetic waves of a specific resonant frequency, which is the communication frequency; and first and second electrodes connected to the filter circuit. The metal film is formed so as to lap the outer periphery of the container in a direction intersecting the slit. The first electrode and the second electrode of the RFID module are each electrically connected to the metal film with the slit interposed between the electrodes.

Inventors:
OMORI RYOHEI (JP)
KATO NOBORU (JP)
YAZAKI HIROKAZU (JP)
SAITO MIKIKO (JP)
Application Number:
PCT/JP2021/037397
Publication Date:
May 12, 2022
Filing Date:
October 08, 2021
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
B65D5/44; G06K19/077; B65D5/62; H01Q1/22; H01Q13/22
Domestic Patent References:
WO2009004827A12009-01-08
Foreign References:
JP2009031893A2009-02-12
JP2020021389A2020-02-06
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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