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Patent Searching and Data


Title:
CONTAINER PROVIDED WITH RFID MODULE
Document Type and Number:
WIPO Patent Application WO/2022/097682
Kind Code:
A1
Abstract:
Provided is a container provided with: an insulating base material forming the outer shape of the container; a metal film formed on the base material; a slot formed in the base material in the region in which the metal film is formed; and an RFID module. The RFID module is provided with: an RFIC element; a filter circuit which transmits an electric current resulting from electromagnetic waves having a unique resonant frequency, which is a communication frequency, to the RFIC element; and first and second electrodes connected to the filter circuit. The first electrode of the RFID module and the metal film are electrically connected to one another, and the second electrode of the RFID module and the metal film are electrically connected to one another with the RFID module straddling the slot.

Inventors:
OMORI RYOHEI (JP)
KATO NOBORU (JP)
YAZAKI HIROKAZU (JP)
SAITO MIKIKO (JP)
Application Number:
PCT/JP2021/040609
Publication Date:
May 12, 2022
Filing Date:
November 04, 2021
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
G06K19/077; B65D5/44; B65D5/62; H01Q1/22; H01Q13/10
Domestic Patent References:
WO2009005080A12009-01-08
Foreign References:
CN102372120A2012-03-14
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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