Title:
CONTROL DEVICE FOR INJECTION-MOLDING MACHINE
Document Type and Number:
WIPO Patent Application WO/2024/100763
Kind Code:
A1
Abstract:
Provided is a technology that, in an injection-molding machine, can effectively reduce molding defects by making it possible for a user to suitably ascertain a melting state of resin. A control device 10 for an injection-molding machine 1 comprises: an operation information acquisition unit 11 that acquires operation information pertaining to operations of heaters 24a-24d; a characteristic information acquisition unit 12 that acquires characteristic information pertaining to a characteristic of the injection-molding machine 1; a heater heat generation amount calculation unit 13 that calculates the heat generation amount of the heaters 24a-24d on the basis of the acquired operation information and the acquired characteristic information; a heater heat transfer amount calculation unit 14 that calculates the heat transfer amount from the heaters 24a-24d to resin on the basis of the heat generation amount of the heaters 24a-24d at the time when molding is carried out in a state in which the cylinder 22 is maintained at a prescribed set temperature and the heat generation amount of the heaters 24a-24d at the time when the molding is stopped in the state in which the cylinder 22 is maintained at the prescribed set temperature; a melting state determination unit 15 that determines a melting state of the resin inside the cylinder 22 on the basis of a calculation result of the heater heat transfer amount calculation unit 14; and an output unit 20 that outputs a determination result of the melting state determination unit 15.
Inventors:
NAKAMURA KYOUSUKE (JP)
Application Number:
PCT/JP2022/041550
Publication Date:
May 16, 2024
Filing Date:
November 08, 2022
Export Citation:
Assignee:
FANUC CORP (JP)
International Classes:
B29C45/76
Domestic Patent References:
| WO2021246524A1 | 2021-12-09 |
Foreign References:
| JP2001225372A | 2001-08-21 |
Attorney, Agent or Firm:
SHOBAYASHI Masayuki et al. (JP)
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