CONTROL METHOD, ELECTRONIC COMPONENT MOUNTING DEVICE, AND CORRECTION SUBSTRATE

WIPO Patent Application WO/2019/244264

A1

The present invention addresses the problem of providing a technique which makes it possible to increase correction accuracy relating to the movement of a mounting head, while suppressing an increase in inspection time. A correction substrate includes a row of marks of which the Y address is an odd number and a row of marks of which the Y address is an even number, the marks being arranged at a predetermined pitch in the X-direction. The marks of which the Y address is an odd number and the marks of which the Y address is an even number have different positions in the X-direction. Thus, when correction is made in the X-direction, correction accuracy can be improved by using an error based on the detected positions of the marks included in adjacent rows and having different X-positions.

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JP2002537589	INDUSTRIAL APPLICABILITY [Invention title] Device mounting method, device and device portion
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KONDO DAIGO (JP)

PCT/JP2018/023401

December 26, 2019

June 20, 2018

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FUJI CORP (JP)

H05K13/04; H05K13/00

JP2001244696A	2001-09-07
JPH11274799A	1999-10-08
JP2012038834A	2012-02-23
JP2001516503A	2001-09-25
JPH01227499A	1989-09-11
JP2001136000A	2001-05-18

See also references of EP 3813502A4

NEXT INTERNATIONAL et al. (JP)

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