Title:
CONTROL MODULE, HEAT DISSIPATION SYSTEM AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2023/230928
Kind Code:
A1
Abstract:
Provided in the present application are a control module (10), a heat dissipation system and an electronic apparatus. The control module (10) comprises a cold plate (300), a first housing (110), a first circuit board (120), a second housing (210) and a second circuit board (220). The cold plate (300) comprises a first surface (301) and a second surface (302); a first accommodating space (101) is formed by means of enclosure of the first housing (110) and the first surface (301); a second accommodating space (102) is formed by means of enclosure of the second housing (210) and the second surface (302); the first housing (110) and the second housing (210) are both hermetically and detachably connected to the cold plate (300); the first circuit board (120) and the second circuit board (220) are respectively positioned in the first accommodating space (101) and the second accommodating space (102); the first circuit board (120) is provided with a first chip (121) and a first heat conduction structure (122); the first heat conduction structure (122) is positioned between the first chip (121) and the first surface (301); the cold plate (300) dissipates heat away from the first chip (121) by means of the first heat conduction structure (122); the second circuit board (220) is provided with a second chip (221) and a second heat conduction structure (222); and the cold plate (300) dissipates heat away from the second chip (221) by means of the second heat conduction structure (222). The control module (10) in the present application has a good heat dissipation effect and a reduced volume, and ensures sealing performance and maintenance convenience of the circuit boards.
Inventors:
PENG YAOFENG (CN)
Application Number:
PCT/CN2022/096485
Publication Date:
December 07, 2023
Filing Date:
May 31, 2022
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H05K7/20
Foreign References:
| CN112822899A | 2021-05-18 | |||
| CN108109976A | 2018-06-01 | |||
| CN102169876A | 2011-08-31 | |||
| EP3941172A1 | 2022-01-19 | |||
| US20220122751A1 | 2022-04-21 |
Attorney, Agent or Firm:
SCIHEAD IP LAW FIRM (CN)
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