CONTROL SETTING DEVICE AND CONTROL SETTING METHOD

WIPO Patent Application WO/2011/048671

A1

Disclosed is a control setting device (200) which includes an execution parameter data storage unit (206d) for storing execution parameter data, an SGF table storage unit (206b) for storing an SGF table, a finishing spray code table storage unit (206c) for storing a finishing spray code table, a component data storage unit (206e) for storing a component data table which indicates components of steel grade families, and a control setting determination unit (201b). When determination is requested for the combination of control setting values in a steel grade family, the control setting determination unit (201b) determines the combination of control setting values in accordance with the component data table, component data, target plate thickness and target plate width included in a setting request signal, first control data, and execution parameter data. When determination is requested for the combination of control setting values in a steel grade, the control setting determination unit (201b) determines the combination of control setting values in accordance with second control data, the steel grade, target plate thickness and target plate width included in the setting request signal, and execution parameter data.

OHARA KAZUHIRO (JP)
SHIMODA NAOKI (JP)
SANO MITSUHIKO (JP)

PCT/JP2009/068111

April 28, 2011

October 21, 2009

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TOSHIBA MITSUBISHI ELEC INC (JP)
OHARA KAZUHIRO (JP)
SHIMODA NAOKI (JP)
SANO MITSUHIKO (JP)

B21B37/00; B21B37/76; B21B45/02

JP2007245204A	2007-09-27
JPH1133616A	1999-02-09
JPS63119919A	1988-05-24

MIYOSHI, Hidekazu et al. (JP)
Hidekazu Miyoshi (JP)

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