Title:
CONTROL OF SOLDER BOND LINE THICKNESS WITH SQUEEZED GOLD BUMP SPACE
Document Type and Number:
WIPO Patent Application WO/2022/266786
Kind Code:
A1
Abstract:
A method for assembling a fiber mount to a base, comprising: placing metal spacers and solder between the fiber mount and the base, applying a squeezing force with a configured time, thus providing a precise control of the gap between the fiber mount and the base, thereby preventing the solder from cracking and reducing the impact of solder creep.
Inventors:
CHEN JIAN (US)
QIU ANDY (CN)
BAJWA SUKHBIR (US)
PETWONG JARIN (TH)
QIU ANDY (CN)
BAJWA SUKHBIR (US)
PETWONG JARIN (TH)
Application Number:
PCT/CN2021/101149
Publication Date:
December 29, 2022
Filing Date:
June 21, 2021
Export Citation:
Assignee:
LUMENTUM OPERATIONS LLC (US)
International Classes:
B23K1/00; G02B6/42
Foreign References:
| JP2007281393A | 2007-10-25 | |||
| JP2010080710A | 2010-04-08 | |||
| CN108971804A | 2018-12-11 | |||
| JP2007043010A | 2007-02-15 | |||
| CN1447142A | 2003-10-08 | |||
| US6205264B1 | 2001-03-20 | |||
| CN105281197A | 2016-01-27 | |||
| CN104011949A | 2014-08-27 |
Attorney, Agent or Firm:
LIU, SHEN & ASSOCIATES (CN)
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