Title:
COOLER AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/034291
Kind Code:
A1
Abstract:
The present invention suppresses the occurrence of a deviated flow distribution in a cooler and the increase in pressure loss. A cooler (10) comprises, inside a container (14): a first flow path (14e) disposed parallel with a first side wall (14a) and communicating with an introduction port (11); a second flow path (14f) disposed parallel with a second side wall (14b) and communicating with a discharge port (12); a third flow path (14g) communicating with the first flow path (14e) and the second flow path (14f); a first flow rate adjustment unit (15) disposed between the first flow path (14e) and the third flow path (14g); and a second flow rate adjustment unit (16) disposed between the second flow path (14f) and the third flow path (14g). The first flow rate adjustment unit (15) includes a first region (15a) having a first opening ratio and a second region (15b) having a second opening ratio smaller than the first opening ratio. The second flow rate adjustment unit (16) includes a third region (16a) having a third opening ratio and a fourth region (16b) having a fourth opening ratio greater than the third opening ratio.
Inventors:
SANO DAIKI (JP)
Application Number:
PCT/JP2023/024795
Publication Date:
February 15, 2024
Filing Date:
July 04, 2023
Export Citation:
Assignee:
FUJI ELECTRIC CO LTD (JP)
International Classes:
H01L23/473; F28F3/00; F28F9/22; H05K7/20
Domestic Patent References:
| WO2019211889A1 | 2019-11-07 | |||
| WO2015079643A1 | 2015-06-04 |
Foreign References:
| JP2012069892A | 2012-04-05 | |||
| JP2015053318A | 2015-03-19 | |||
| JP2006179771A | 2006-07-06 | |||
| JP2010140964A | 2010-06-24 |
Attorney, Agent or Firm:
FUSO INTERNATIONAL PATENT FIRM (JP)
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