Title:
COOLING COMPONENT AND DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/270123
Kind Code:
A1
Abstract:
Provided are: a cooling component which, when one region of an object to be cooled is cooled with priority, is capable of efficiently cooling another region of the object to be cooled using a refrigerant used in the cooling of the object to be cooled; and a device. The cooling component cools the object to be cooled that includes a high-temperature region and another region. Inside the cooling component, disposed is a flow passage through which the refrigerant that is supplied from a supply port and discharged toward a discharge port flows. The cooling component includes a cooling part opposing the high-temperature region and another cooling part opposing the other region. The flow passage includes: a refrigerant supply passage that includes an upstream-side passage disposed inside the cooling part opposing the high-temperature region and that cools the high-temperature region by the refrigerant supplied from the supply port; a connecting passage that connects to the refrigerant supply passage and that is disposed at a position further from the object to be cooled than the upstream-side passage; and a refrigerant discharge passage that is disposed inside the other cooling part, that includes a downstream-side passage connected to the connecting passage, that cools the other region by the refrigerant, and that discharges the refrigerant to the discharge port.
Inventors:
ISOYA SATOSHI (JP)
Application Number:
PCT/JP2022/017021
Publication Date:
December 29, 2022
Filing Date:
April 04, 2022
Export Citation:
Assignee:
NEC PLATFORMS LTD (JP)
International Classes:
H01L23/473; G06F1/20; H05K7/20
Foreign References:
| JP2006506603A | 2006-02-23 | |||
| JP2006303306A | 2006-11-02 | |||
| JP2021102169A | 2021-07-15 |
Attorney, Agent or Firm:
KITAJIMA Hiroshi et al. (JP)
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