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Title:
COOLING DEVICE FOR HOT-DIP PLATED STEEL SHEET
Document Type and Number:
WIPO Patent Application WO/2016/063414
Kind Code:
A1
Abstract:
A cooling device for a hot-dip plating device, which is provided above a plating thickness control device in a transport path for a hot-dip plated steel sheet transported upward, vertically from a plating bath, is provided with a main cooling device for spraying a main cooling gas perpendicular to the hot-dip plated steel sheet and a preliminary cooling device provided in a preliminary cooling space between the main cooling device and the plating thickness control device in the transport path for spraying a preliminary cooling gas to a plurality of gas impact positions provided along the preliminary cooling space.

Inventors:
OOHASHI TOORU (JP)
MACHIDA KAZUKI (JP)
NAKATA HIROSHI (JP)
KOJIMA KATSUYA (JP)
HAYAKAWA KOHHEI (JP)
Application Number:
PCT/JP2014/078361
Publication Date:
April 28, 2016
Filing Date:
October 24, 2014
Export Citation:
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Assignee:
NIPPON STEEL & SUMITOMO METAL CORP (JP)
International Classes:
C23C2/26; C23C2/40
Foreign References:
JP2008115462A2008-05-22
JP2004059945A2004-02-26
JPH04183844A1992-06-30
Other References:
See also references of EP 3211112A4
Attorney, Agent or Firm:
SHIGA Masatake et al. (JP)
Masatake Shiga (JP)
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