COOLING DEVICE FOR INSTANTANEOUS COOLING

Title:

COOLING DEVICE FOR INSTANTANEOUS COOLING

Document Type and Number:

WIPO Patent Application WO/2023/096424

Kind Code:

A1

Abstract:

Provided is a cooling device for instantaneous cooling, the cooling device comprising: a water inflow pipe having an inlet through which to-be-cooled water that requires cooling flows in; a housing having an outlet through which cold water, obtained by cooling the to-be-cooled water that has flowed in via the inlet, is discharged; a refrigerant circulation pipe provided, on the outer surface of the housing, as a spiral surrounding the housing; and an ice spiral which is formed as a spiral on the inner wall of the housing by the refrigerant circulation pipe.

More Like This:

WO/2014/040845	VACUUM COOLING SYSTEM, FOOD PROCESSING SYSTEM COMPRISING SUCH A VACUUM COOLING SYSTEM, AND METHOD FOR OPERATING SUCH A VACUUM COOLING SYSTEM
JPS58137983	【考案の名称】低温冷却装置
WO/2002/085103	HYDROPONIC FEEDER AND COOLER

Inventors:

CHOI SEONG JUN (KR)
PARK SA UN (KR)
PARK HYUNG MI (KR)

Application Number:

PCT/KR2022/018897

Publication Date:

June 01, 2023

Filing Date:

November 25, 2022

Export Citation:

Click for automatic bibliography generation Help

Assignee:

GSI CO LTD (KR)
LIXIL CORP (JP)

International Classes:

F25D31/00; B67D1/08; F25D3/02; F28D7/02

Domestic Patent References:

WO2016094107A1

2016-06-16

Foreign References:

JP2017146008A	2017-08-24
JP2015508150A	2015-03-16
JPH05296633A	1993-11-09
US2496466A	1950-02-07
KR101804385B1	2017-12-05

Attorney, Agent or Firm:

KEY IP&LAW FIRM (KR)

Download PDF:

View/Download PDF PDF Help

Previous Patent: ANTI-INFLAMMATORY COMPOSITION USING MICRONEEDLE PATCH LOADED WITH ZINC COMPLEX COMPOSITION

Next Patent: OXIDE SEMICONDUCTOR, MANUFACTURING METHOD THEREFOR, AND SEMICONDUCTOR DEVICE COMPRISING SAME