Title:
COOLING DEVICE AND MANUFACTURING METHOD FOR COOLING DEVICES
Document Type and Number:
WIPO Patent Application WO/2020/137822
Kind Code:
A1
Abstract:
This cooling device has a heat receiving unit that has a space therein, liquid phase piping that supplies liquid phase refrigerant to the heat receiving unit, gas phase piping that discharges gas phase refrigerant from the heat receiving unit, and spacers that are disposed inside the heat receiving unit. The spacers have a higher specific gravity than the liquid phase refrigerant. The spacers have a shape allowing movement along the bottom face of the heat receiving unit. When the heat receiving unit tilts, the spacers move to the low side of the heat receiving unit. The spacers collect on the bottom face of the heat receiving unit on the low side because the specific gravity thereof is higher than the liquid phase refrigerant 2. The liquid phase refrigerant spreads to the high side of the heat receiving unit by an amount equivalent to the volume removed due to the spacers, and uniform cooling can be performed.
Inventors:
MORIMINE SHINYA (JP)
Application Number:
PCT/JP2019/049878
Publication Date:
July 02, 2020
Filing Date:
December 19, 2019
Export Citation:
Assignee:
NEC PLATFORMS LTD (JP)
International Classes:
F28D15/02
Domestic Patent References:
| WO2010058520A1 | 2010-05-27 | |||
| WO2018047529A1 | 2018-03-15 | |||
| WO2011040129A1 | 2011-04-07 |
Foreign References:
| JP2005321152A | 2005-11-17 | |||
| KR101305437B1 | 2013-09-26 | |||
| JP2018115858A | 2018-07-26 | |||
| JP2009088125A | 2009-04-23 |
Attorney, Agent or Firm:
SHIMOSAKA Naoki (JP)
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