Title:
COOLING DEVICE AND METHOD FOR MANUFACTURING COOLING DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/270047
Kind Code:
A1
Abstract:
This cooling device for cooling a heat-generating element comprises: a substrate having a trench; a plate material provided on the substrate so as to close off the trench; a capillary structure part provided in a space formed by the plate material and the trench, and having a hollow section therein; and a cooling medium filled inside the capillary structure part.
Inventors:
HSIEH TSUNGTING (TW)
HO KWUN-YAO (TW)
HO KWUN-YAO (TW)
Application Number:
PCT/JP2022/012008
Publication Date:
December 29, 2022
Filing Date:
March 16, 2022
Export Citation:
Assignee:
NIDEC CORP (JP)
International Classes:
F28D15/02; F28D15/04; H01L23/427; H05K7/20
Foreign References:
| JP2011102691A | 2011-05-26 | |||
| JP2017003160A | 2017-01-05 | |||
| JP2003080378A | 2003-03-18 | |||
| JP2016156584A | 2016-09-01 |
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