COOLING DEVICE, AND COOLING METHOD FOR COOLING DEVICE

WIPO Patent Application WO/2023/181117

A1

The present invention provides a cooling device and a cooling method capable of adjusting a cooling capacity in accordance with an object to be cooled.　A cooling device according to the present invention includes a refrigeration cycle for causing a refrigerant to circulate between a plurality of evaporators (1) for causing heat of target objects (S) to be absorbed by the refrigerant, a compressor (2) for compressing the refrigerant that has received heat in the evaporators (1), and a condenser (3) for dissipating heat from the refrigerant compressed by the compressor (2) to cause the refrigerant to condense, the cooling device being provided with first header piping (4) for supplying the refrigerant that has received heat in the plurality of evaporators to the compressor (2), and second header piping (5) for supplying the refrigerant condensed by the condenser (3) to the plurality of evaporators (1), wherein the evaporators (1) are provided respectively for the plurality of target objects (S), and the evaporators (1) are respectively configured to be capable of adjusting an amount of heat absorbed from the target objects (S).

TODOROKI KOICHI (JP)
YOSHIKAWA MINORU (JP)
KOBAYASHI KENJI (JP)
MIYAMOTO YOSHINORI (JP)
CHIBA MASAKI (JP)
HACHIYA MAHIRO (JP)
OHTSUKA TAKASHI (JP)
KANEKO NOBUO (JP)
YAMAMOTO HIROMI (JP)

PCT/JP2022/013160

September 28, 2023

March 22, 2022

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NEC CORP (JP)

F25B5/02

WO2021005701A1

2021-01-14

JP2013175069A	2013-09-05
JP2014163548A	2014-09-08
JP2006509294A	2006-03-16
JP2022032788A	2022-02-25

TANAI Sumio et al. (JP)

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