COOLING DEVICE, SEMICONDUCTOR MANUFACTURING DEVICE, AND SEMICONDUCTOR MANUFACTURING METHOD

Title:

COOLING DEVICE, SEMICONDUCTOR MANUFACTURING DEVICE, AND SEMICONDUCTOR MANUFACTURING METHOD

Document Type and Number:

WIPO Patent Application WO/2023/243184

Kind Code:

A1

Abstract:

Provided is a cooling device for cooling an object to be cooled, the cooling device being characterized by having a circulation system for circulating a refrigerant for cooling the object to be cooled, wherein: the circulation system is provided with a container which includes a region for performing heat exchange between the refrigerant and at least a portion of the object to be cooled; the refrigerant is a mixed refrigerant obtained by mixing a first refrigerant having a first boiling point and a second refrigerant having a second boiling point higher than the first boiling point; the circulation system circulates the mixed refrigerant such that the mixed refrigerant enters the container at a prescribed temperature; and the vapor pressure of the first refrigerant at the prescribed temperature is higher than the withstand pressure of the container.

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Inventors:

NOMOTO MAKOTO (JP)

Application Number:

PCT/JP2023/013209

Publication Date:

December 21, 2023

Filing Date:

March 30, 2023

Export Citation:

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Assignee:

CANON KK (JP)

International Classes:

F28D15/02; F25B1/00; F25B5/04; G03F7/20; H05K7/20

Foreign References:

JP2022020088A	2022-02-01
JP2004232951A	2004-08-19
JP2007163086A	2007-06-28
JPH0660306B2	1994-08-10

Attorney, Agent or Firm:

OHTSUKA PATENT OFFICE, P.C. (JP)

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