Title:
COOLING DEVICE AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/248989
Kind Code:
A1
Abstract:
A cooling device, according to one embodiment of the present disclosure, is for cooling heating elements, and comprises: a housing; a first flow path; and a second flow path. The housing has an inflow port and an outflow port for a refrigerant, and includes a first region which is in contact with a first heating element, and a second region which is in contact with a second heating element. The first flow path connects the inflow port and the outflow port, and overlaps with the first region and the second region in a planar view of the housing. The second flow path joins the first flow path at a position downstream of the first region and upstream of the second region. In addition, the second flow path has a guide portion for guiding the refrigerant, which flows through the second flow path, to the first flow path.
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Inventors:
YOSHIOKA FUMIYOSHI (JP)
Application Number:
PCT/JP2023/022655
Publication Date:
December 28, 2023
Filing Date:
June 19, 2023
Export Citation:
Assignee:
NIDEC CORP (JP)
International Classes:
H01L23/473; H01L25/07; H01L25/18; H05K7/20
Domestic Patent References:
| WO2012147544A1 | 2012-11-01 | |||
| WO2016194158A1 | 2016-12-08 | |||
| WO2022255159A1 | 2022-12-08 |
Foreign References:
| JP2013055056A | 2013-03-21 | |||
| JP2005079337A | 2005-03-24 | |||
| JP2010153785A | 2010-07-08 |
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