Title:
COOLING DEVICE
Document Type and Number:
WIPO Patent Application WO/2013/150071
Kind Code:
A3
Abstract:
The invention relates to a cooling device (26) for cooling an electronic component, in particular a power semiconductor, comprising a cooling body (14) which can be thermally coupled to the component, at least one sonotrode element (12) for generating ultrasonic waves having a predetermined wavelength directed towards the cooling body (14), and a resonance tube (16) which is associated with the sonotrode element (12) and which is arranged between the sonotrode element (12) and the cooling body (14). According to the invention, a distance between the sonotrode element (12) and the cooling body (14) corresponds to an integral multiple of the quarter of the wavelength, such that a standing wave is formed between sonotrode element (12) and the cooling body (14).
Inventors:
HONSBERG-RIEDL MARTIN (DE)
LOESCHKE JAKOB (DE)
MITIC GERHARD (DE)
MOCK RANDOLF (DE)
VONTZ THOMAS (DE)
LOESCHKE JAKOB (DE)
MITIC GERHARD (DE)
MOCK RANDOLF (DE)
VONTZ THOMAS (DE)
Application Number:
PCT/EP2013/057022
Publication Date:
December 05, 2013
Filing Date:
April 03, 2013
Export Citation:
Assignee:
SIEMENS AG (DE)
International Classes:
B06B3/00; H05K7/20; H01L23/467
Foreign References:
| DE102011087484A1 | 2013-06-06 |
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