Title:
COOLING DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/104842
Kind Code:
A1
Abstract:
A cooling device is provided with an evaporator, a heat dissipater, a liquid pipe, and a vapor pipe, the liquid pipe and the vapor pipe connecting the evaporator and the heat dissipater. An operating fluid is supplied from the liquid pipe to the evaporator and is vaporized therein. The vaporized fluid flows to the heat dissipater through the vapor pipe and is liquefied therein. The cooling device is characterized in that the evaporator has a housing section and a wick which is provided within the housing and which consists of a porous body, the wick being provided with ribs in contact with the housing section, the operating fluid being adapted to enter the inside of the wick and to be vaporized at the portions where the ribs of the wick and the housing sections are in contact, the bottom surfaces of the grooves between the ribs being covered with a wick cover, the wick cover being formed from the same material as the wick and having a lower porosity than the wick.
Inventors:
UCHIDA HIROKI (JP)
Application Number:
PCT/JP2014/050364
Publication Date:
July 16, 2015
Filing Date:
January 10, 2014
Export Citation:
Assignee:
FUJITSU LTD (JP)
International Classes:
F28D15/02
Domestic Patent References:
| WO2012049752A1 | 2012-04-19 |
Foreign References:
| JP2001221584A | 2001-08-17 | |||
| JPH09264681A | 1997-10-07 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
Tadashige Ito (JP)
Tadashige Ito (JP)
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