COOLING DEVICE

WIPO Patent Application WO/2019/159776

A1

This cooling device (1) is equipped with a plurality of cooling device components that are integrally joined in a laminated state, wherein the plurality of components comprise an electric insulation layer (3), an upper heat conduction member (11) disposed on the upper side of the electric insulation layer (3), and a lower heat conduction member (12) disposed on the lower side of the electric insulation layer (3). In the upper heat conduction member (11), the thermal conductivity in the thickness direction Z and the thermal conductivity in a first direction parallel to the flat surface are higher than the thermal conductivity in a second direction perpendicular to the thickness direction and the first direction. In the lower heat conduction member (12), the thermal conductivity in the thickness direction Z and the thermal conductivity in a first direction parallel to the flat surface are higher than the thermal conductivity in a second direction perpendicular to the thickness direction Z and the first direction. The upper heat conduction member (11) and the lower heat conduction member (12) are arranged in such a manner that the first direction of the upper heat conduction member (11) intersects with the first direction of the lower heat conduction member (12) in a plan view.

KURAHASHI SHUNSUKE (JP)
OKUNO KATSUKI (JP)
OKUNO YOSHISHIGE (JP)
MINAMI KAZUHIKO (JP)
MATSUSHIMA SEIJI (JP)

PCT/JP2019/004174

August 22, 2019

February 06, 2019

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SHOWA DENKO KK (JP)

H01L23/36; H01L23/373; H05K7/20

WO2017130512A1

2017-08-03

JPH05175378A	1993-07-13
JP2011258755A	2011-12-22
JP2013243248A	2013-12-05

SHIMIZU Yoshihito et al. (JP)

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