Technical field

The present invention pertains to the technical field of cooling devices.

In particular, the present invention relates to a cooling device that could be advantageously implemented in a vehicle, especially to improve the cooling of its electronic devices.

Background art

It is known that the functioning of electronic devices generates heat which needs to be correctly managed or otherwise it could decrease the efficiency of said electronic devices and even reach a level sufficient to damage them. Consequently, it is highly desirable to develop means to cool down the electronic devices, for example by removing heat from them.

In this context, it is known to put the electronic devices in thermal contact with an element at a lower temperature so that heat can be transferred between them.

In particular, a possible solution consists in coupling the electronic devices with a circuit inside which a cooling fluid flows.

In a first portion of the circuit the cooling fluid receives the heat generated by the electronic devices and conveys it away from them in a second portion wherein it releases the heat, for example, into the environment.

Specifically, in this situation the electronic devices are positioned along the first portion of the circuit to ensure that all of them are able to interact with the cooling fluid.

However, even the above solution presents considerable drawbacks that reduce the overall efficiency of the cooling process.

In particular, as the cooling fluid progresses through the circuit it increases its temperature, thus decreasing its ability to absorb heat from the electronic device placed downstream along the first portion.

Consequently each electronic device interacts with a cooling fluid at a different and increasingly high temperature, thus resulting in an uneven, inconsistent and unreliable cooling.

Disclosure of the invention

In this context, the technical purpose which forms the basis of the invention is to provide a cooling device which overcomes the above-mentioned drawbacks of the prior art.

In particular, the aim of the invention is to provide a cooling device with an increased efficiency deriving from a novel and innovative structure that allows for a better and more efficient distribution of the cooling fluid to the components to be cooled.

The technical purpose indicated and the aims specified are substantially achieved by a cooling device comprising the technical features described in one or more of the appended claims.

The invention describes a cooling device which comprises a main body defining internally a duct for a cooling fluid.

The duct comprises an inlet portion, a cooling portion and an outlet portion. The inlet portion is configured to receive the cooling fluid into the main body. The outlet portion is configured to evacuate the fluid from the main body.

The cooling portion is configured to receive the cooling fluid from the inlet portion and to release it to the outlet portion.

Furthermore, the cooling portion comprises a plurality of distinct flanking channels.

The channels are arranged in a parallel configuration.

Each channel is thermally couplable with one respective electronic device so that the cooling fluid flowing through each channel may absorb heat from its respective electronic device.

In particular, the cooling fluid flowing through a specific channel may, along the cooling portion, absorb heat only and exclusively from the electronic device coupled to that channel.

Furthermore, the inlet portion is configured to feed to each channel a respective volume of cooling fluid at the same temperature.

Advantageously, the specific structure provided by the cooling device of the present invention allows to distribute evenly, at the same time, a cooling fluid at an optimal and identical temperature to all the devices that need to be cooled down.

Brief description of drawings

Further features and advantages of this invention are more apparent in the detailed description below, with reference to a preferred, non-restricting, embodiment of a cooling device as illustrated in the accompanying drawings, in which:

- figure 1 shows a view of the cooling device according to the present invention;

- figure 2 shows the internal structure of the cooling device;

- figure 3 shows a section of the cooling device;

- figure 3A shows a detail of the cooling device with one of its element disassembled.

Detailed description of preferred embodiments of the invention

The present invention concerns a cooling device 1 that can be advantageously implemented to cool down the component of a vehicle, in particular the electronic devices mounted on said vehicle which can specifically be its power electronic devices.

From a structural point of view the cooling device 1 essentially comprises a main body which internally defines a duct for a cooling fluid.

In other words, the main body is shaped in such a way as to provide for a duct along which the cooling fluid can circulate from an entering point to an exit point.

More in detail, the aforementioned duct comprises an inlet portion 2, a cooling portion 3 and an outlet portion 4.

The inlet portion 2 is configured to receive the cooling fluid into the main body and may be thus connected to a source/reservoir of said cooling fluid. The outlet portion 4 is correspondingly configured to allow the evacuation of the cooling fluid from the main body, for example, feeding it to any kind of element able to receive the cooling fluid.

Operatively, the cooling device 1 may be installed as a portion of a cooling circuit so that the cooling fluid that is evacuated may return inside the duct through the inlet portion 2 after having been treated to reduce its temperature and being thus able again to absorb heat from the electronic devices.

In general, the duct may thus define a portion of a cooling circuit along which the cooling fluid may continuously flow propelled, for example, by a pump. The cooling portion 3 is interposed between the inlet portion 2 and the outlet portion 4, so that it is able to receive the cooling fluid from the first and release it to the latter.

The cooling portion 3 comprises a plurality of distinct flanking channels 3a arranged in a parallel configuration.

In other words, the cooling portion 3 is subdivided into a plurality of channels 3a which are each independently and autonomously interfaced with the inlet portion 2 at one end and with the outlet portion 4 at the other end.

In this way all the channels 3a can independently receive the cooling fluid directly from the inlet portion 2 and release it to the outlet portion 4 and the volume of cooling fluid that flows through a specific channel 3a does not pass through any other channel 3a before reaching the outlet portion 4, meaning that each channel 3a receives a respective volume of cooling fluid and all the respective volumes are at the same temperature when they enter the respective channel 3a.

Furthermore, each channel 3a is thermally couplable with one respective electronic device, in particular the above-mentioned power electronic device.

Consequently, the cooling fluid flowing through each channel 3a may absorb heat from the respective electronic device. More in detail, the cooling fluid passing through a specific channel 3a may exchange heat only with the specific electronic device coupled to said channel 3a.

Advantageously, it is thus possible to transfer heat between the cooling fluid and the electronic devices in a homogeneous way, cooling them down in the exact same way, insofar all the electronic devices are interfaced with respective volumes of cooling fluid that present all the same temperature. With reference to the preferred embodiments shown in the accompanying figures, the inlet portion 2 presents an inlet opening 2a which is connectable to the source of the cooling fluid to receive said cooling fluid and to allow it to enter inside the duct defined by the main body.

The inlet portion 2 further presents a feeding conduit departing from the inlet opening 2a and developing along the cooling portion 3 to be independently in direct fluid connection with each channel 3a.

In other words, the feeding conduit develops along a main direction from a starting point corresponding with the inlet opening 2a towards an ending point and along its length it faces the cooling portion 3 so as to be able to feed the cooling fluid to each and all channels 3a separately.

As could be seen in figure 2, the overall width of the inlet portion 2 is not the same along the feeding conduit but varies, specifically decreases, as it reaches its ending point.

In particular, the feeding conduit presents a first portion which is proximal to the inlet opening 2a and a second portion which is distal from the inlet opening 2a.

In other words the first portion develops from the starting point to an intermediate point positioned between the starting point and the ending point, while the second portion develops from the intermediate point to the ending point.

The first portion and the second portion present different width and specifically the first portion is wider than the second portion.

Furthermore, along each of the first portion and the second portion the width of the feeding conduit may be constant or may vary, in particular it may decrease regularly or according to one or more specific patterns (for example a stepped pattern) towards the ending point.

In particular, the width of the second portion of the feeding conduit can be variable and defined at each point of the second portion as a function of its distance from the inlet opening 2a.

In other words, the width of the feeding conduit at the ending point is smaller than its width at any other point and in particular smaller than the width at the starting point.

Advantageously, the specific shape of the inlet portion 2 which defines a feeding conduit with a varying width allows to obtain a homogenous pressure at the entrance of each channel 3a, guaranteeing an optimal and equal distribution of the cooling fluid between each channel 3a.

Further to the above, the feeding conduit may also comprise at least one inlet pin 1 1 (for example three inlet pins as shown in figure 2) positioned at the inlet opening 2a.

In other words, the inlet pins 1 1 are placed in the feeding conduit near the inlet opening 2a so as to be able to intercept the cooling fluid as soon as it enters the inlet portion 2.

Specifically, the at least one inlet pin 1 1 is configured to intercept the cooling fluid entering the inlet portion 2 so as to induce a turbulent flow of said cooling fluid as it moves along the feeding conduit, thus promoting an even more efficient distribution of a cooling fluid having the same temperature to all the channels 3a.

To increase the number of electronic devices that may be interfaced in an optimal way with the cooling device 1 , the channels 3a are organized in two superimposed rows (as clearly visible in figures 3 and 3A) which preferably comprise the same number of channels 3a.

According to this specific geometry, the channels 3a of each row present a first side which is couplable with the electronic devices and a second side, opposite to the first side, shared with a channel 3a of a different row. In other words, the channels 3a present a common side which is shared between the two rows and opposite sides that can be coupled with the electronic devices.

As a result, the electronic devices coupled to respective channels 3a of one row are spatially separated from the electronic devices coupled to the channels 3a of the other row.

To also reduce, ideally avoid, unwanted heat exchanges, the walls that define and separate the various channels 3a are also configured to prevent heat to move from one channel 3a to the adjacent ones.

In other words, the cooling portion 3 comprises separation walls 5 which are interposed between adjacent channels 3a (either of the same row and of different rows) and said separation walls 5 provide for a barrier that prevents heat to transit from channel 3a to channel 3a so as to keep each one of them thermally independent and thus able to exchange heat only with the respective electronic device.

To obtain the above effect it is possible to select the width of the separating walls 5 depending on the expected temperature for the cooling fluid inside the channels 3a, so that if the device 1 is meant to be used with higher expected temperatures its separating walls 5 can be designed to be thicker (thus providing for a stronger thermal insulation between adjacent channels).

An alternative or additional option would be to apply to the separating walls 5 a coating made of a material with low thermal conductivity.

In other words, the separating walls 5 may presents a width sufficient to prevent heat exchanges between adjacent channels and/or comprise a coating made of a thermally insulating material.

Furthermore, the separation walls 5 interposed between respective adjacent channels 3a belonging to the same row preferably have a width sufficient to guarantee that also the electronic devices coupled to the channels 3a of the same row remain physically separated, i.e., not in direct contact with each other. Generally speaking, the cooling portion 3 is shaped in such a way as to define the plurality of channels 3a and to separate them with walls that prevent heat exchanges between adjacent channels 3a and preferably also between adjacent electronic devices.

Furthermore, the separation walls 5 that separates adjacent channels 3a belonging to the same row may also comprise coupling means 5a configured to couple/fasten the electronic devices to the main body.

For example, the electronic devices may be screwed onto the main body and the separation walls 5 may present a plurality of threaded seats configured to receive the screws which form part of the coupling means 5a. Furthermore, the cooling portion 3 may also comprise for each channel 3a a plurality of pins 6, which develop inside the respective channel 3a, preferably along a direction perpendicular to a direction of flow of the cooling fluid inside the channels 3a (as can be clearly seen in figures 3 and 3A).

Advantageously the presence of the pins 6 inside the channels 3a increases the exchange surface through which heat may be transferred between the cooling fluid and the electronic devices.

More in detail, the pins 6 depart from the first side of each channel 3a and develop toward the second side.

Concerning the structure of the cooling device 1 , according to a possible embodiment the main body is a plate-like body.

In other words, the main body has a planar configuration that presents a first planar side and a second planar side each couplable with a respective plurality of electronic devices and with the duct for the cooling fluid being defined between said sides.

In particular, the plate-like body is made up at least of a central body 7, an upper plate 8 and a lower plate 9.

The central body 7 is shaped so as to define a lateral wall of the inlet portion 2 and of the outlet portion 4 and at least the second side of each channel 3a.

Furthermore, the central body 7 also defines the separation walls 5 interposed between adjacent channels 3a.

Preferably, the separation walls 5 are shaped in such a way as to define respective walls of the channels 3a devoid of any sharp angle.

Preferably, the central body 7 is also shaped so as to define lateral walls of the inlet portion 2 and of the outlet portion 4 that present only curved corners.

In other words, the lateral walls of the duct are all defined by a plurality of straight portions connected with each other via respective curved portions that consequently do not present sharp angles.

The above feature promotes the correct flowing of the cooling fluid reducing the risk of creating unwanted obstacles and accumulation pockets wherein the cooling fluid may remain trapped.

The upper plate 8 is coupled to a first face of the central body 7 and defines with it the first side of an upper row of channels 3a.

The lower plate 9 is instead coupled to a second face of the central body 7 and defines with it the first side of a lower row of channels 3a.

In particular, the upper plate 8 and the lower plate 9 may be attached to the central body 7 with friction stir welding (FSW) technology.

Furthermore, the upper plate 8 and the lower plate 9 are coupled to define respective opposite sides of the inlet portion 2 and the outlet portion 4.

In other words, the internal structure of the duct, in particular the structure of the channels 3a, is defined by the central body 7, which is then closed on its first and second side by the upper and lower plate 8, 9, respectively.

The upper plate 8 and the lower plate 9 thus define the interface between the cooling fluid and the electronic devices at the channels 3a and also concur to outline the profile of the inlet portion 2 and the outlet portion 4.

As visible in particular in figure 3A, when present the pins 6 depart from the upper plate 8 and the lower plate 9, extending away from respective surfaces of the same which are configured to face the central body 7.

Furthermore, the pins 6 are preferably integral with the upper plate 8 and the lower plate 9. Preferably, the pins 6 are positioned on the surface of the upper and lower plate 8, 9 in such a way as to define a profile that mirrors that of the channels 3a, so that in an assembled configuration the pins 6 occupy the entire width and length of the channels 3a.

Further to the above, the cooling device 1 may also comprise fastening means 10 that are configured to couple and fasten the upper plate 8 with the lower plate 9 in such a way as to maintain said upper plate 9 and lower plate 8 fastened to the central body 7.

In particular, the fastening means 10 pass through the main body 7 (not necessarily by entering in contact with it) and are preferably positioned in the inlet portion 2 (as shown in the figures) and/or in the outlet portion 4. Thanks to the fastening means 10, the upper plate 8 and the lower plate 9 are stably linked to each other and consequently even when the cooling fluid flows through the device they remain in position.

In particular, the presence of the fastening means 10 prevent the plates 8, 9 from bulging and deforming under the pressure which may be applied by the cooling fluid flowing through the cooling device 1 .

Advantageously, the fastening means 10 may also be configured to allow the fastening of one or more further electronic devices to the cooling device 1.

In particular, said fastening means 10 may allow to couple to the upper plate 8 and/or to the lower plate 9 electronic devices such as a DC link for the power electronic devices and/or any other devices required for the correct functioning of the electronic devices coupled to the channels 3a.

It is observed that the fastening means 10 may link to the cooling device 1 an electronic device which may or not need/require to be cooled down and which may or not be put in thermal contact with the cooling fluid through the upper or lower plate 8, 9.

Furthermore, the fastening means 10 may comprise one or more hollow pins passing through the central body 7, thus providing for a passage that may be used to allow a wiring of the electronic devices to pass from the lower side of the cooling device 1 to its upper side and to keep it in position. The present application further refers to a power unit which may be advantageously implemented in the automotive field.

In particular the power unit comprises a cooling device 1 corresponding to the above description, i.e., presenting one or more of the technical features presented above.

The power unit further comprises a plurality of electronic devices.

Each electronic device is coupled to the cooling device in thermal contact with only one respective channel 3a of the cooling portion 3.

In other words, each electronic device is able to exchange heat only with the respective channel.

Preferably, the cooling device 1 , specifically its main body, also comprises at least one opening and/or compartment configured to lodge at least one between a wiring, a control unit or one or more sensors of the electronic devices.

In other words, the cooling device 1 is shaped so as to allow the above- mentioned elements to be coupled to it and to allow an easy coupling for the same with the electronic devices, keeping them easily accessible at the same time.