COOLING INTEGRATED SYSTEM

WIPO Patent Application WO/2024/037306

A1

The present application relates to the technical field of cooling devices, and provides a cooling integrated system, which is used for cooling a computing device provided with a cooling channel. The cooling integrated system comprises a housing and a cooling apparatus integrated and packaged in the housing; the cooling apparatus comprises a heat exchange mechanism, a liquid inlet pipe, a liquid return pipe, and a conveying pump; the liquid inlet pipe is communicated with the heat exchange mechanism and the cooling channel; the liquid return pipe is communicated with the heat exchange mechanism and the cooling channel; the conveying pump is mounted on the liquid inlet pipe and/or the liquid return pipe; and the conveying pump is used for conveying a cooling liquid to circularly flow between the heat exchange mechanism and the cooling channel of a server so as to cool the server. The cooling apparatus in the cooling integrated system is arranged in a connected manner, and a user does not need to connect the cooling apparatus and the cooling channel of the server.

HUANG SHAOMING (CN)
HU HANGKONG (CN)
ZENG HONGBO (CN)
HAO MINGLIANG (CN)
XIAO SHENGQIANG (CN)
XHENG PENGFEI (CN)
PENG YURONG (CN)
PI TE (CN)
LI FENGJIE (CN)
ZHU HONGSHAN (CN)

PCT/CN2023/109647

February 22, 2024

July 27, 2023

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BITMAIN TECH INC (CN)

H05K7/20

CN218514728U	2023-02-21
CN215187964U	2021-12-14
CN217064362U	2022-07-26
CN114269129A	2022-04-01
CN114710938A	2022-07-05
US20120155027A1	2012-06-21

SHENZHEN LIDAO INTELLECTUAL PROPERTY AGENCY (GENERAL PARTNERSHIP) (CN)

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