Title:
COOLING PACKAGE AND POWER MODULE
Document Type and Number:
WIPO Patent Application WO/2018/076177
Kind Code:
A1
Abstract:
A cooling package in a power module (401,503) comprises a first side for placing one or more semiconductor components (406,501); one or more holes for placing one or more magnetic components (305); and a second side with one or more connection parts. Therefore, all components of a power module (401,503) which need to dissipate the heat have two thermal dissipation paths, therefore the heat inside the module can be greatly reduced.
Inventors:
MA TAI (CN)
LI PEIHUA (CN)
LI PEIHUA (CN)
Application Number:
PCT/CN2016/103234
Publication Date:
May 03, 2018
Filing Date:
October 25, 2016
Export Citation:
Assignee:
ERICSSON TELEFON AB L M (SE)
MA TAI (CN)
MA TAI (CN)
International Classes:
H05K7/20
Foreign References:
| CN102917571A | 2013-02-06 | |||
| CN103929935A | 2014-07-16 | |||
| CN204859861U | 2015-12-09 | |||
| CN103650655A | 2014-03-19 | |||
| CN101802937A | 2010-08-11 | |||
| US20050152117A1 | 2005-07-14 | |||
| US20020054480A1 | 2002-05-09 |
Other References:
See also references of EP 3533303A4
Attorney, Agent or Firm:
CHINA SCIENCE PATENT & TRADEMARK AGENT LTD. (CN)
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