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Patent Searching and Data


Title:
COOLING STRUCTURE AND ELECTRIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2021/132171
Kind Code:
A1
Abstract:
A cooling structure (50) is provided with: a body (10) including a base (11) and heat-dissipating fins (13) and a protrusion (13T) which protrude from a heat-dissipating surface (12); a lid member (20) disposed so as to cover the protrusion (13T) and the heat-dissipating fins (13) and forming a flow path (18); and a fan mechanism (30). The fan mechanism (30) includes a blade (31b), a driver (31a) for rotating the blade, and a wire (31c) for supplying electric power to the driver. The protrusion (13T) has a first through-hole (13h). The base (11) has a second through-hole (11h) in communication with the first through-hole (13h). The wire (31c) is connected to the driver and includes a first portion (31d) disposed between the lid member (20) and the body (10), and a second portion (31e) continuous with the first portion (31d) and passed through the first through-hole (13h) and the second through-hole (11h). With the cooling structure, it is possible to improve heat-dissipating performance and sealing performance.

Inventors:
TAKEUCHI TAKASHI (JP)
ITO TOSHIAKI (JP)
OSHITA YOSHIAKI (JP)
HIDAKA HIDEHIKO (JP)
MORIYA SHIGEYUKI (JP)
Application Number:
PCT/JP2020/047713
Publication Date:
July 01, 2021
Filing Date:
December 21, 2020
Export Citation:
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Assignee:
TOYOTA JIDOSHOKKI KK (JP)
NIDEC CORP (JP)
International Classes:
H05K7/20; H01L23/467; H05K7/00; H05K9/00
Foreign References:
JPH06268125A1994-09-22
CN209229696U2019-08-09
JP2019022293A2019-02-07
JP2009033900A2009-02-12
US6477047B12002-11-05
KR20160116255A2016-10-07
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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