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Title:
COOLING STRUCTURE, AND STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2023/224017
Kind Code:
A1
Abstract:
This cooling structure has an outer covering material in which a coolant inlet and outlet are disposed. The outer covering material has a metal layer and a resin layer disposed on at least one side of the metal layer, and has a conduction part that conducts in the thickness direction of the cooling structure wherein the periphery of the conduction part is insulated.

Inventors:
FUKUKAWA YUJI (JP)
YAMASHITA TAKAHIRO (JP)
ITO SEIICHI (JP)
SHODA HIROAKI (JP)
Application Number:
PCT/JP2023/018178
Publication Date:
November 23, 2023
Filing Date:
May 15, 2023
Export Citation:
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Assignee:
RESONAC CORP (JP)
International Classes:
H01L23/473; H05K7/20
Foreign References:
JP2017038009A2017-02-16
JP2005123317A2005-05-12
JP2005061690A2005-03-10
JP2020003132A2020-01-09
JP2020068066A2020-04-30
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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