FIELD

[01 ] The present technology relates to cooling devices in general and specifically to a cooling device for an electronic component.

BACKGROUND

[02] There are many industries where cooling may be desirous or required. Some of these industries require precise control of cooling. Others require cooling that is un-interrupted and does not stop in case of power failure, for example. Some of these industries include but are not limited to: telecommunications, medical industry, crypto-currency mining, precise manufacturing and the like. Same problems exist for companies who maintain computer equipment (such as servers or the like). As the number of equipment co-located in a given dwelling grows, the equipment heats up fast and requires continuous cooling for un-interrupted operations.

[03] It is known in the art to use stationary or mobile air-conditioning units that allow for precise temperature control. Naturally, all of this equipment requires power supply in order to operate. There have been some attempts in the art to address the problems associated with backup power and/or alternative cooling sources, especially for those industries where continuous cooling is a critical parameter for operational stability. For companies who operate computer equipment and/or servers, the uninterrupted cooling of computer equipment and/or servers can be a critical operational parameter to ensure uninterrupted data processing and integrity of the computing equipment and/or servers. There have been some attempts in the art to address the problems associated with the cost of solutions for cooling electronic components. Reducing the cost of equipment and of the power requirement for running cooling systems is desirable.

[04] US Patent publication no. 2016/0198593 discloses a cooling system that provides cooling air for an operating space of a large scale information handling system.

SUMMARY

[05] It is an object of the present technology to ameliorate at least some of the inconveniences present in the prior art. [06] Different approaches can be used for cooling electronic components found in a data center facility. One way of providing cooling is installing an Air-Conditioning (A/C) system in the data center facility. However, such a cooling solution is expensive due to the cost of the A/C system itself, as well as the cost of power needed to continuously run it.

[07] Developers of the present technology have realized that cooling systems employing a “free-cooling mode” are considerably less expensive to operate. In this mode, cool outside air is used for extracting heat and removing it from the data center facility. The free-cooling mode is particularly efficient when outdoor temperatures are relatively lower to indoor temperatures and/or desired operating temperature of electrical components inside the data center facility.

[08] Developers of the present technology have realized that cooling systems employing the “mechanical mode”, also referred to as the “closed-loop mode” can be more efficient at higher outdoor temperatures. In this mode, cooling air removes heat from the electronic components and then transfers this heat to a heat exchange system for further evacuating this heat from the recirculating loop of air inside the cooling system.

[09] Developers of the present technology have devised a cooling system that is configured to selectively operate in at least one of (i) the free-cooling mode and (ii) the closed-loop mode. One or more sensors may be employed for monitoring outside air temperature and air temperatures inside different portions of the cooling system. This sensor data can be used by a controller for triggering one or more actions including switching between a first and a second mode of operation.

[10] In response to a mode switch condition being met, one or more valves can be operated in order to form distinct air flow channels inside the cooling system. In response to the mode switch condition being met, one or more sub-systems of the cooling system can be operated for removing heat from the electronic component. Such sub-systems may include a heat transferring sub-system and a pressure sub-system.

[11] In the free-cooling mode, one or more valves may be operated in order to form a free- cooling air channel allowing outside air to be driven by the pressure sub-system for cooling the electronic components and removing latent heat. In the closed-loop mode, one or more valves may be operated in order to form, instead of the free-cooling air channel, two separate channels, namely a closed-loop channel and an exhaust channel. In the closed-loop mode, the pressure sub-system may be used for driving recirculated air through the electronic components in the closed-loop channel and outside air in the exhaust channel. In the closed-loop mode, the heat transferring sub-system may be used for removing heat from the recirculating air and transferring it to the outside air driven in the exhaust channel.

[12] In the context of the present technology, the pressure sub-system may include one or more multi-purpose fan(s) located in an exhaust chamber of the cooling system. These fans are used for different purposes and depending on whether the cooling system is operating in a free- cooling mode, or otherwise in the closed-loop mode.

[13] On the one hand, in the free-cooling mode, the multi-purpose fan(s) can be used by the cooling system for selectively driving outside air through the free-cooling channel . On the other hand, in the closed-loop mode, the multi-purpose fan(s) can be used by the cooling system for selectively driving outside air through the heat transferring sub-system in the exhaust channel.

[14] In further embodiments, the developers have devised a cooling system with multipurpose fans that can be operated at different speeds for improving the efficiency of the heat transferring sub-system. In particular, the speed of the multi-purpose fans can be controlled in order to increase a condensation temperature of the heat transferring fluid circulated in the heat transferring sub-system.

[15] Developers of the present technology have realized that designing a cooling system that is configured to selectively operate in the free-cooling and closed-loop modes while employing the same exterior exhaust fans is advantageous in terms of reduced cost of cooling system components and of the power necessary to run it.

[16] In a first broad aspect of the present technology there is provided a cooling system for cooling an electronic component. The cooling system comprises an electronic controller for controlling operation of the cooling system. The cooling system comprises a ducting subsystem including a main chamber, the main chamber having a cool zone and a warm zone separated by the electronic component, an exhaust chamber for removing heated air from the cooling system, and a plurality of valves for providing selective air communication between an outside air source, the main chamber, and the exhaust chamber. The plurality of valves being selectively actuatable for operating the cooling system in a first cooling mode and a second cooling mode. The cooling system comprises a heat exchanging sub-system including an evaporator located in the cool zone, a condenser located in the exhaust chamber, and a compressor for driving heat transferring fluid between the evaporator and the condenser. The cooling system comprises a multi-purpose fan located in the exhaust chamber for selectively driving air: in the first cooling mode, from the warm zone towards the outside air source, and in the second cooling mode, from the outside air source through the condenser.

[17] In some embodiments of the cooling system, the cooling system is configured to, in the first cooling mode: actuate a first set from the plurality of valves for defining a free-cooling channel, the free-cooling channel extending through the cool zone, the electronic component, the warm zone and the multi-purpose fan; and operate the multi-purpose fan for driving air through the free-cooling channel.

[18] In some embodiments of the cooling system, the cooling system is configured to, in the second cooling mode: actuate a second set from the plurality of valves for defining, instead of the free-cooling channel , separate ones of (i) a closed-loop channel and (ii) an exhaust channel, the closed-loop channel extending through the cool zone, the evaporator, the electronic component, and the warm zone, the exhaust channel extending through the condenser and the multi-purpose fan; and operate the compressor for transferring heat from the evaporator in the closed-loop channel to the condenser in the exhaust channel; and operate the multi-purpose fan for driving air through the exhaust channel.

[19] In some embodiments of the cooling system, the cooling system is further configured to control speed of the multi-purpose fan for controlling a condensation temperature of the heat transferring fluid in the condenser.

[20] In some embodiments of the cooling system, the cooling system further has an other fan located in the cool zone of the main chamber, the other fan for driving air from the cool zone towards the electronic component.

[21] In some embodiments of the cooling system, the cool zone of the main chamber further has a mixing sub-zone, the plurality of valves including a pair of valves. One from the pair provides selective air communication between the outside air source and the mixing sub-zone, the other one from the pair providing selective air communication between the warm zone and the mixing sub-zone. The cooling system is further configured to, in the first cooling mode: actuate the pair of valves in an anti-phase configuration for controlling a proportion of (i) air from the outside air source and (ii) air from the war zone entering the mixing-subzone. [22] In some embodiments of the cooling system, the cooling system has a filtering subsystem located in the cool zone of the main chamber.

[23] In a second broad aspect of the present technology, there is provided a method of switching cooling modes in a cooling system. The cooling system for cooling an electronic component. The cooling system comprises an electronic controller for controlling operation of the cooling system. The cooling system comprises a ducting sub-system including: a main chamber, the main chamber having a cool zone and a warm zone separated by the electronic component; an exhaust chamber for removing heated air from the cooling system; a plurality of valves for providing selective air communication between an outside air source, the main chamber, and the exhaust chamber, the plurality of valves including: an outside-cooling valve for selective air communication between an outside air source and the cool zone; a cool-warm valve for selective air communication between the cool zone and the warm zone; a warmexhaust valve for selective air communication between the warm zone and the exhaust chamber; an outside-exhaust valve for selective air communication between the outside air source and the exhaust chamber. The cooling system comprises a heat exchanging sub-system including: an evaporator in the cool zone, a condenser in the exhaust chamber, and a compressor for driving cooling fluid between the evaporator and the condenser. The cooling system comprises a pressure sub-system including: a first fan located in the cool zone for driving air from the cool zone to the warm zone through the electronic component, the air for cooling the electronic component as it flows from the cool zone to the warm zone; and a multi-purpose fan located in the exhaust chamber for selectively driving air: in the first cooling mode, from the warm zone towards the outside air source, and in the second cooling mode, from the outside air source through the condenser. The controller is communicatively coupled with the plurality of valves, the heat-exchange sub-system, and the pressure sub-system. The method is executable by the controller. The method comprises triggering a free-cooling mode of operation in response to the outside air source being at a temperature below a threshold temperature. The free-cooling mode including: opening, by the controller, the outside-cool valve and the warm-exhaust valve for defining a free-cooling channel extending through the cool zone, the first fan, the electronic component, the warm zone and the multi-purpose fan; operating, by the controller, the first fan for driving air in the free-cooling channel from the cool zone through the electronic component towards the warm zone; and operating, by the controller, the multi-purpose fan for removing at least some air from the warm zone through the exhaust chamber. The method comprises triggering a closed-loop mode of operation in response to the outside air source being at the temperature above the threshold temperature. The closed-loop mode including: closing, by the controller, the outside-cool valve and the warm-exhaust valve, and opening, by the controller, the outside-exhaust valve, thereby defining, instead of the free-cooling channel, separate ones of (i) a closed-loop channel and (ii) an exhaust channel, the closed-loop channel extending through the cool zone, the evaporator, the first fan, the electronic component, and the warm zone; the exhaust channel extending through the condenser and the multi-purpose fan; operating, by the controller, the compressor for cooling the air in the closed-loop channer as recirculating air flows through the evaporator and heating the air in the exhaust chamber as the outside air flows through the condenser; operating, by the controller, the multi-purpose fan for removing heated air by the condenser from the exhaust chamber.

[24] In some embodiments of the method, the method comprises, in the closed-loop mode, controlling speed of the multi-purpose fan for controlling a condensation temperature of the heat transferring fluid in the condenser.

[25] In some embodiments of the method, the cool zone of the main chamber further has a mixing sub-zone, the plurality of valves including a pair of valves. One from the pair providing selective air communication between the outside air source and the mixing sub-zone, the other one from the pair provides selective air communication between the warm zone and the mixing sub-zone. The method further comprising, in the free-cooling mode: actuating the pair of valves in an anti-phase configuration for controlling a proportion of (i) air from the outside air source and (ii) air from the war zone entering the mixing-subzone.

[26] In a third broad aspect of the present technology, there is provided a method of cooling an electronic component. The method executable by an electronic controller of a cooling system. The cooling system comprises a ducting sub-system including: a main chamber, the main chamber having a cool zone and a warm zone separated by the electronic component; an exhaust chamber for removing heated air from the cooling system; and a plurality of valves for providing selective air communication between an outside air source, the main chamber, and the exhaust chamber. The plurality of valves is selectively actuatable for operating the cooling system in a first cooling mode and a second cooling mode. The cooling system comprises a heat exchanging sub-system including: an evaporator located in the cool zone, a condenser located in the exhaust chamber, and a compressor for driving heat transferring fluid between the evaporator and the condenser. The cooling system comprises a multi-purpose fan located in the exhaust chamber for selectively driving air: in the first cooling mode, from the warm zone towards the outside air source, and in the second cooling mode, from the outside air source through the condenser. The method comprises, in a first cooling mode: actuating a first set from the plurality of valves for defining a free-cooling channel, the free-cooling channel extending through the cool zone, the electronic component, the warm zone and the multi-purpose fan; and operating the multi-purpose fan for driving air through the free-cooling channel.

[27] In some embodiments of the method, the method further comprises, in the second cooling mode: actuating a second set from the plurality of valves for defining, instead of the free-cooling channel, separate ones of (i) a closed-loop channel and (ii) an exhaust channel, the closed-loop channel extending through the cool zone, the evaporator, the electronic component, and the warm zone, the exhaust channel extending through the condenser and the multi-purpose fan; and operating the compressor for transferring heat from the evaporator in the closed-loop channel to the condenser in the exhaust channel; and operating the multi-purpose fan for driving air through the exhaust channel.

[28] In some embodiments of the method, the method further comprises controlling speed of the multi-purpose fan for controlling a condensation temperature of the heat transferring fluid in the condenser.

[29] In some embodiments of the method, the cooling system further has an other fan located in the cool zone of the main chamber, the other fan for driving air from the cool zone towards the electronic component.

[30] In some embodiments of the method, the cool zone of the main chamber further has a mixing sub-zone, the plurality of valves including a pair of valves. One from the pair provides selective air communication between the outside air source and the mixing sub-zone, the other one from the pair providing selective air communication between the warm zone and the mixing sub-zone. The method further comprises, in the first cooling mode: actuating the pair of valves in an anti-phase configuration for controlling a proportion of (i) air from the outside air source and (ii) air from the war zone entering the mixing-subzone.

[31] In some embodiments of the method, the method further comprises selectively switching operation of cooling system from the first cooling mode to the second cooling mode in response to a switching condition being met. [32] In the context of the present specification, the words “first”, “second”, “third”, etc. have been used as adjectives only for the purpose of allowing for distinction between the nouns that they modify from one another, and not for the purpose of describing any particular relationship between those nouns. Thus, for example, it should be understood that, the use of the terms “first server” and “third server” is not intended to imply any particular order, type, chronology, hierarchy or ranking (for example) of/between the server, nor is their use (by itself) intended imply that any “second server” must necessarily exist in any given situation. Further, as is discussed herein in other contexts, reference to a “first” element and a “second” element does not preclude the two elements from being the same actual real-world element. Thus, for example, in some instances, a “first” server and a “second” server may be the same software and/or hardware, in other cases they may be different software and/or hardware.

[33] Implementations of the present technology each have at least one of the above- mentioned object and/or aspects, but do not necessarily have all of them. It should be understood that some aspects of the present technology that have resulted from attempting to attain the above-mentioned object may not satisfy this object and/or may satisfy other objects not specifically recited herein.

[34] Additional and/or alternative features, aspects and advantages of implementations of the present technology will become apparent from the following description, the accompanying drawings and the appended claims.

BRIEF DESCRIPTION OF THE DRAWINGS

[35] For a better understanding of the present technology, as well as other aspects and further features thereof, reference is made to the following description which is to be used in conjunction with the accompanying drawings, where:

[36] Figure 1 is an illustration of a data center facility having a cooling system, in accordance with non-limiting embodiments of the present technology.

[37] Figure 2 depicts a schematic diagram of the cooling system of Figure 1, the cooling system being implemented in accordance with non-limiting embodiments of the present technology. [38] Figure 3 depicts a schematic diagram of the cooling system of Figure 2 operating in a free-cooling mode, in accordance with non-limiting embodiments of the present technology.

[39] Figure 4 depicts a schematic diagram of the cooling system of Figure 2 operating in a closed-loop mode, in accordance with non-limiting embodiments of the present technology.

[40] Figure 5 is a schematic diagram of a method executed by a controller the cooling system of Figure 2 in accordance with some embodiments of the present technology.

DETAILED DESCRIPTION

[41] With reference to Figure 1, there is illustrated a data center facility 100. Broadly speaking, a data center facility, sometimes referred to as a data storage center, datacenter, data storage facility or data storage vault, is a building which houses mission-critical systems for an operator such as computing and communications hardware. For example, data backup service providers can employ autonomous, disaster-hardened data center facilities to maintain the integrity of their data storage infrastructure. In another example, internet service providers can employ dedicated facilities for storing and securing a large number of back-end electronic components used for supporting online services.

[42] Data center facilities can feature strictly controlled physical environments, such as: climate control to maintain temperature/humidity ideal for equipment operation, uninterruptible power supply (UPS) system, diesel-powered generators, fire prevention & extinguishing systems, onsite security personnel. Additionally, data backup providers can utilize an identical secondary facility for redundancy and maximum fault tolerance. A data center facility generally operates on networks using IP protocols, with redundant connectivity provided from more than one network communications provider. A data center facility may further be protected by cybersecurity layers designed to prevent intrusion threats to the hardware itself, or the information stored therein. Such cybersecurity layers may include virtual private networks (VPNs), intrusion detection systems, firewalls, and the like.

[43] The data center facility 100 includes a cooling system 201 with multi-purpose fan(s) 250 being implemented in accordance with non-limiting embodiments of the present technology. It should be noted that where the cooling system 201 can be used is not at all limited. For example, the cooling system 201 can be used by a service provider (not depicted), the service provider operating a number of servers or other computing devices. Within those embodiments, the cooling system 201 may be used to cool a room (or multiple rooms) where the servers or other computing devices are located. In other embodiments of the present technology, the cooling system may be used by a hospital to cool patient rooms or room(s) storing equipment and/other computing devices.

[44] In the above examples, it is possible to say that the cooling system 201 is implemented as a stationary cooling system, in a sense that it is not movable and is more or less located in a single geographical location. It is also possible to implement the cooling system 201 as a mobile cooling station, for example, the cooling system 201 can be used to cool goods in transit. There are numerous examples of goods that need to be transported from one geographical location to another geographical location, while requiring constant cooling - such as perishable food items or medical goods (such as for example, transplant organs).

[45] In the non-limiting embodiments of the present technology, the cooling system 201 is used for controlling one or more parameters of the physical environment in which the hardware equipment inside the data center facility 100 is stored and/or operated. It can be said that the cooling system 201 is used for controlling an operational temperature of one or more electronic components located inside the data center facility 100. The type of electronic component that can be located inside the data center facility 100 is not particularly limited.

[46] For example, the data center facility 100 may include one or more servers to be used in a network of servers. The hardware may be one physical computer or one physical computer system, but neither is required to be the case with respect to the present technology. It is also contemplated that the data center facility 100 may include one or more server racks. A server rack is a rack specifically designed to hold and organize computer equipment. Many operations require more than one piece of hardware to perform their necessary functions. Stacking servers and other electronic equipment in a rack helps keep thing organized and makes it easier to control airflow. Operators choose to use enclosed server racks for many reasons. In some cases, they are used for security purposes against thieves or accidental damage. In other cases, they are used for easier control of airflow through the electronic components contained therein.

[47] In another example, the data center facility 100 may include one or more electronic devices implemented as any computer hardware that can run software appropriate to the relevant task at hand of the operator. Thus, some examples of devices include personal computers (desktops, laptops, netbooks, etc.), smartphones, and tablets, as well as network equipment such as routers, switches, and gateways. It should be noted that a device acting as a device in the present context is not precluded from acting as a server to other devices.

[48] In a further example, the data center facility 100 may include one or more electronic components for implementing a database. Broadly, a “database” is any structured collection of data, irrespective of its particular structure, the database management software, or the computer hardware on which the data is stored, implemented or otherwise rendered available for use. A database may reside on the same hardware as the process that stores or makes use of the information stored in the database or it may reside on separate hardware, such as a dedicated server or plurality of servers.

[49] With reference to Figure 2, there is depicted a schematic diagram of the cooling system

201. The cooling system 201 comprises a main chamber 202 and an exhaust chamber 208. The main chamber 202 has a cool zone 204 leading to an electronic component 210, and a warm zone 206 fluidly located after the electronic component 210.

[50] The cooling system 201 also has a plurality of valves (not separately numbered) for providing selective air communication between an outside air source 290, the main chamber

202, and the exhaust chamber 208. In the non-limiting illustrated example, the plurality of valves includes a first valve 211 , a second valve 212, a third valve 213 , and a fourth valve 214.

[51] The first valve 211 can be said to be an “outside-cool” valve since the first valve provides selective air communication between an outside air source 290 and the cool zone 204. The second valve 212 can be said to be an “warm-cool” valve since the second valve 212 provides selective air communication between the warm zone 206 and the cool zone 204. The third valve 213 can be said to be a “warm-exhaust” valve since the third valve 213 provides selective air communication between the warm zone 206 and the exhaust chamber 208. The fourth valve 214 can be said to be an “outside-exhaust” valve since the fourth valve 214 provides selective air communication between the outside air source 290 and the exhaust chamber 208.

[52] In some embodiments of the present technology, the cool zone 204 of the main chamber 202 may further have a mixing sub-zone 240. As illustrated, a pair of valves including the first valve 211 and the second valve 212 provide selective air communication between the outside air source 290 and the mixing sub-zone 240, and between the warm zone 206 and the mixing sub-zone 240. As it will be discussed herein further below, the first valve 211 and the second valve 212 may be actuated in a specific manner during the free-cooling mode for controlling air temperature in the mixing sub-zone 240.

[53] It can be said that the cooling system 201 has a ducting sub-system including chambers, zones, and/or sub-zones defined by a ducting structure, and a plurality of valves for providing selective air communication between the chambers, zones, and/or sub-zones in the ducting structure. The ducting structure can be manufactured from any suitable material and may or may not include structural elements of the data center facility 100 itself, such as walls, ceilings, roofs, floors, beams, railings, and the like.

[54] In some embodiments of the present technology, the cooling system 201 may also have a filtering sub-system (not depicted) that is located in the cool zone 204 of the main chamber 202. Broadly speaking, the filtering sub-system may comprise one or more filters of various sizes installed in the cool zone 204 for filtering dust or debris in the air from the outside air source 290. In some embodiments, the filtering sub-system may be installed in the mixing subzone 240 and/or prior to the evaporator 222 and the first fan 230 to avoid damaging the evaporator 222 and the first fan 230 if debris or dust is introduced from the outside air source 290.

[55] It should be noted that although not illustrated on Figure 2, the cooling system 201 may include a plurality of sensors for monitoring a variety of parameters about the exterior and the interior environment. For example, the cooling system 201 may include temperature sensors, pressure sensors, humidity sensors for sensing a verity of parameters as is known in the art about the environment outside the cooling system 201 , and in respective chambers, zones, an/or sub-zones of the cooling system 201 .

[56] The cooling system 201 also has a heat exchanging sub-system 220. The heat exchanging sub-system 220 has an evaporator 222 located in the cool zone 204, a condenser 224 located in the exhaust chamber 208, a compressor 226 and a thermo-control valve 228. Broadly speaking, the cooling system 201 is configured to selectively employ the heat exchanging sub-system 220 when operating in a closed-loop mode for removing heat from the recirculating air used to cool down the electronic component 201.

[57] In the context of the present technology, the evaporator 222 may be a device used in a process to turn the liquid form of a heat transferring fluid into its gaseous-form (vapor). The heat transferring fluid circulating in the evaporator 222 can be heated by a heat source (hot air) and is thereby evaporated, or vaporized, into a gas form. This vaporized fluid is then driven by the compressor 226 towards the condenser 224.

[58] In the context of the present technology, the condenser 224 may be a device used in a process to condense a gaseous fluid into a liquid state through cooling. In so doing, the latent heat is released by the fluid and transferred to the surrounding environment. As such, when the vaporized fluid is driven by the compressor 226 and is circulating inside the condenser 224, cool air can be used for releasing heat and which results in the vaporized fluid condensing and returning to its liquid form. The thermo-control valve 228 may also be used to control fluid pressure (via throttling, for example) in the heat exchanging sub-system 220 when the liquid fluid returns to the evaporator 222.

[59] The cooling system 201 also has a pressure sub-system (not numbered) including a first fan 230 located in the cool zone 204 and a multi-purpose fan 250 located in the exhaust chamber 208. The purpose of the first fan 230 is to drive air from the cool zone 204 to the warm zone 206 through the electronic component 210 for cooling the electronic component 210 as it flows from the cool zone 204 to the warm zone 206. It is contemplated that more than one first fans and more than one multi-purpose fans may be employed in different implementations of the present technology.

[60] In the context of the present technology, the multi-purpose fan 250 located in the exhaust chamber 208 can be employed by the cooling system 201 for different purposes, depending on whether the cooling system 201 is operating in a free-cooling mode, or otherwise in the closed- loop mode. On the one hand, in the free-cooling mode, the multi-purpose fan 250 can be used by the cooling system for selectively driving air from the warm zone 206 towards the outside air source 290. On the other hand, in the closed-loop mode, the multi-purpose fan 250 can be used by the cooling system for selectively driving air from the outside air source 290 through the condenser 224.

[61] The cooling system 201 also has a controller (not depicted) communicatively coupled with the plurality of valves, the heat exchanging sub-system 220, and the pressure sub-system. The controller may comprise one or more electronic components configured to control the operation of the cooling system 201. The controller may include a hardware processor configured to execute computer-readable commands for performing a variety of actions on different components of the cooling system 201. For example, the controller may receive data from one or more sensors of the cooling system 201.

[62] How the cooling system 201 is configured to operate in the free-cooling mode and in the closed-loop mode will now be discussed in turn in greater details with reference to Figures 3 and 4, respectively.

Free-cooling mode

[63] With reference to Figure 3, there is depicted a representation 300 of the cooling system 201 operating in a free-cooling mode. The controller may be configured to control various components of the cooling system 201 so that the cooling system 201 forms a free-cooling channel 350.

[64] In some embodiments of the present technology, the controller may be configured to monitor outside air temperature via one or more sensors. In response to the outside air temperature (i.e., temperature of the outside air source 290) being below a threshold temperature value, the controller may operate components of the cooling system 201 to form the free-cooling channel 350.

[65] In one implementation, the threshold temperature value used by the controller for triggering the free-cooling mode of operation is 30 degrees Celsius. In other embodiments, the controller may trigger the free-cooling mode of operation if the outside air temperature is within a threshold range of temperature values. Hence, in some implementations, the controller may trigger the free-cooling mode of operation in response to the outside air temperature being between 18 degrees Celsius and 40 degrees Celsius.

[66] In further embodiments, it is contemplated that the free-cooling mode of operation may be a default mode of operation of the cooling system 201. As such, the cooling system 201 may switch to a closed-loop mode of operation in response to the current outside air temperature to be equal or above 30 degrees Celsius. In other implementations, the switch between the default mode of operation and the closed-loop mode of operation may be triggered if the current outside air temperature is between 18 and 40 degrees Celsius - in this case, if the current outside air temperature is below 18 degrees Celsius, the cooling system 201 continues to operate in the default mode of operation. [67] Let it be assumed that in response to the comparison of the current outside air temperature against the threshold temperature value, the controller determines that the current outside air temperature is below the threshold temperature value. In response, the controller may transmit one or more signals for at least some of: turning off the heat exchanging subsystem 220, opening the first valve 211, closing the second valve 212, turning on the first fan 230, opening the third valve 213, closing the fourth valve 214, and turning on the multi-purpose fan 250.

[68] In this mode of operation, the first fan 230 drives air from the outside air source 290 (at a temperature that is below the threshold temperature value) through the opened first valve 211, through the evaporator 222 (which is not used in the free-cooling mode), through the first fan 230 and towards the electronic component 210 which is cooled by the driven air. In this mode of operation, the multi-purpose fan 250 is operated for driving air from the warm zone 206, which has been heated by the electronic component 210, through the third valve 213 into the exhaust chamber 208, and through the multi-purpose fan 250 towards the outside.

[69] It should be noted that in this mode of operation, the cooling system 201 uses sufficiently cold air from the outside air source 290 for performing energy-efficient cooling of the electronic component 210. The controller may be configured to continuously monitor the outside air temperature, even when the cooling system 201 is already operating in the free-cooling mode.

[70] In some embodiments of the present technology, the cooling system 201 may also be configured to control temperature of air used for cooling the electronic component 210 when in the free-cooling mode. For example, it may desirable to cool the electronic component 210 with air at a pre-set temperature value. In one implementation, it may be desirable to cool the electronic component 210 with air that is at 24 degrees Celsius. In another implementation, the electronic component 210 may be cooled with air that is between 22 and 26 degrees Celsius. Further, in those implementations were the electronic component 210 is a Solid-State Drives (SSD) and/or Hard Disk Drive (HDD), the electronic component 210 may be cooled with air that is between 40 and 50 degrees Celsius. Additionally, in those implementations were the electronic component 210 is a Graphics Processing Unit (GPU), the electronic component 210 may be cooled with air that is below 90 degrees Celsius. In another example, it may be detrimental to use extremely cold air for cooling the electronic component 210 as it may damage the hardware. [71] In those situations where the outside air temperature is below the temperature threshold value, and is also below the pre-set temperature value, the controller may be configured to switch the cooling system 201 from the free-cooling mode of operation to a “modified” free- cooling mode of operation. In this modified free-cooling mode of operation, the controller may be configured to periodically and alternatively open, and close, the first valve 211 and the second valve 212 for intermittently forming a temperature-control sub-channel 380.

[72] It is contemplated that in this modified free-cooling mode of operation, the controller may be configured to operate the pair of valves including the first valve 211 and the second valve 212 in an “anti-phase configuration” where at a given moment in time only one from the pair of valves is opened, while the other one is closed. This allows to alternatively introduce into the mixing sub-zone 240 (i) air from the outside air source 290 (which is at a temperature that is below the pre-set temperature value) and (ii) air from the warm zone 206. Introduction of air from the warm zone 206 in addition to the outside air allows the controller to increase the temperature of the air that will be driven by the first fan 230 towards the electronic component 210.

[73] In some embodiments of the present technology, it is contemplated that the controller may vary the duration of “open” phases and “close” phases of the first valve 211 and of the second valve 212 for controlling a proportion of (i) air from the outside air source 290 and (ii) air from the warm zone 206 that enters the mixing sub-zone 240. For example, during a given period, the controller may have the first valve open for three quarters of that period and closed for one quarter of that period, while having the second valve closed for three quarters of that period and opened for one quarter of that period. Depending on a specific moment in time during that period, the first fan 230 introduces air from either the outside air source 290 or the warm zone 206, depending on which one of the first valve 211 and the second valve 212 is currently opened at that specific moment in time. Additionally, it should be noted that the duration of “open” phases and “close” phases of the first valve 211 and of the second valve 212 may be adjusted by the controller depending on the current air temperature inside the mixing sub-zone 240 with the purpose of bringing it to the pre-set temperature value.

[74] In summary, in some embodiments of the present technology, the cooling system 201 may be configured to operate in a free-cooling mode of operation if the outside air temperature is below the threshold temperature value (or a range of threshold temperature values), and in a modified free-cooling mode of operation if the outside air temperature is further below the pre- set temperature value at which the electronic component 210 is to be cooled. It can be said that in the free-cooling mode of operation and in the modified free-cooling mode of operation, the cooling system 201 may be configured to control the air temperature used for cooling the electronic component 210 without performing any humidity control.

Closed-loop mode

[75] With reference to Figure 4, there is depicted a representation 400 of the cooling system 201 operating in a closed- loop mode. The controller may be configured to control various components of the cooling system 201 so that the cooling system 201 forms two separate channels, namely a closed-loop channel 450 and an exhaust channel 480.

[76] Let it be assumed that in response to the comparison of the current outside air temperature against the threshold temperature value, the controller determines that the current outside air temperature is above the threshold temperature value. In response, the controller is configured to transmit one or more signals for at least some of: turn on the heat exchanging sub-system 220, close the first valve 211, open the second valve 212, turn on the first fan 230, close the third valve 213, open the fourth valve 214 and turn on the multi-purpose fan 250.

[77] In this mode of operation, the first fan 230 drives air towards the electronic component 210 for cooling the electronic component 210. The so-heated air enters the warm zone 206 and is driven through the second valve 212 into the cool zone 204 and towards the evaporator 222. When the heated air passes through the evaporator 222, heat is transferred from the heated air to the heat transferring fluid circulating inside the evaporator 222. In response, the heated air is cooled and the heat transferring fluid is vaporized. After the air has been so-cooled, the air returns to the first fan 230 thereby circulating in a closed-loop in the cooling system 201 without being mixed with air from the outside air source 290.

[78] In this mode of operation, the multi-purpose fan 250 drives air from the outside air source 290 through the fourth valve 214, and towards the condenser 224. When the outside air passes through the condenser 224, heat is transferred from the vaporized heat transferring fluid (driven by the compressor 226 from the evaporator 222) to the outside air being driven by the multi-purpose fan 250 through the condenser 224. In response, the passing outside air is heated and the vaporized heat transferring fluid is condensed into a liquid form. The so-heated air is then removed by the multi-purpose fan 250 from the exhaust chamber 208. The liquified heat transferring fluid is then driven to the evaporator 222 through the thermo-control valve 228. The thermo-control valve 228 may be throttled for controlling pressure of the liquified heat transferring fluid in the evaporator 222.

[79] It is contemplated that in the closed-loop mode of operation, the cooling system 201 may control the temperature of the air used for cooling down the electronic component 210 but also may control the humidity of that air. In the closed-loop mode of operation, recirculating air is used for cooling down the electronic component 210, instead of introducing additional outside air. In this case, the humidity of the re-circulating air may drop since the water in the re-circulating air may condense on the surface of the evaporator 222 and may be eliminated via dedicated ducting (not depicted) from the cooling system 201.

[80] In at least some embodiments of the present technology, the controller may be configured to vary the speed of the multi-purpose fan 250 which in turn allows control of the condensation temperature of the heat transferring fluid inside the condenser 224. In some embodiments, the controller may monitor the temperature inside the condenser 224. The controller may also adjust the speed of the multi-purpose fan 250 for increasing, or decreasing the condensation temperature. In one implementation, the controller may control the speed of the multi-purpose fan 250 so that the condensation temperature is 53 degrees Celcius. Increased condensation temperature may allow reducing the size of the condenser 224 for a similar heat removing capacity.

[81] It is contemplated that the controller may be configured to continuously monitor a current condensation temperature and determine whether the current condensation temperature is at a pre-determined temperature value. For example, the controller may verify whether the current condensation temperature is 53 degrees Celsius. The controller may continuously or periodically adjust the speed of the multi-purpose fan 250 for making sure that the current condensation temperature is equal to the pre-determined condensation temperature value. Keeping a constant condensation temperature at the pre-determined condensation temperature value may increase the efficiency of the cooling system.

[82] In some embodiments, the controller may be configured to execute a method 500, a scheme-block diagram of which is depicted in Figure 5. Various steps of the method 500 will now be discussed in greater details. It should be noted that one or more steps of the method 500 may be optional and/or omitted and/or include additional steps, without departing from the scope of the present technology. STEP 502: Acquiring sensor data

[83] The method 500 begins at step 502 with the controller configured to acquire sensor data from one or more sensors of the cooling system 201. One or more sensors may be employed for monitoring outside air temperature and air temperatures inside different portions of the cooling system 201. In some embodiments, the one or more sensors can include temperature sensors, pressure sensors, humidity sensors, and other suitable sensors for measuring environmental parameters inside and outside the cooling system 201.

[84] In at least some embodiments of the present technology, the controller may receive an indication of a current outside air temperature. In other embodiments, the controller may receive an indication of a current temperature of the electronic component 210. In further embodiments, the controller may receive an indication of a current temperature in a cool zone and/or a warm zone of a cooling system.

STEP 504: Comparing sensor data against a threshold value

[85] The method 500 continues to step 504 with the controller configured to compare sensor data from one or more sensors of the cooling system 201 against a threshold value. For example, the threshold value may be indicative of a threshold temperature and a threshold pressure, and the like.

[86] It can be said that the controller may be configured to monitor whether sensor data from one or more sensors is below and/or above one or more respective threshold values. Such monitoring of sensor data may allow the controller to trigger one or more modes of operation of the cooling system 201. Such monitoring of sensor data may also allow the controller to confirm whether a mode switch condition is met for switching from a current mode of operation of the cooling system 201 to an other, different, mode of operation.

STEP 512: actuating a first set from the plurality of valves for defining a free-cooling channel

187 J Depending on the comparison of the sensor data against a threshold value the controller may be configured to trigger a first mode of operation 510. For operating in the first mode of operation 510, the controller may perform steps 512, and 514. During step 512 with the controller actuates first set from the plurality of valves for defining the free-cooling channel 350. STEP 514: operating the multi-purpose fan for driving air through the free-cooling channel

[88] During step 514 the controller is configured to operate the multi-purpose fan 250 for driving air through the free-cooling channel 350. Additionally, or optionally, operating the multi-purpose fan 250 may comprise the controller configured to control a speed of operation of the multi-purpose fan 250. The controller may control the speed of operation based on sensor data received from one or more sensors of the cooling system 201 .

STEP 522: actuating a second set from the plurality of valves for defining, instead of the free-cooling channel, separate ones of (i) a closed-loop channel and (ii) an exhaust channel

[89] Depending on the comparison of the sensor data against a threshold value the controller may be configured to trigger a second mode of operation 520. For operating in the second mode of operation 520, the controller may perform steps 522, 524, and 526. During step 522 the controller actuates a second set from the plurality of valves for defining the closed-loop channel 450 and the exhaust channel 480.

[90] It is contemplated that the first set and the second set of valves from the plurality of valves may share a subset of valves from the plurality of valves. It is also contemplated that the first set and the second set of valves are mutually exclusive sets of valves in the plurality of valves.

STEP 524: operating the compressor for transferring heat from the evaporator in the closed-loop channel to the condenser in the exhaust channel

[91] During step 524 the controller is configured to operate the compressor for transferring heat from the closed-loop channel 450 to the condenser in the exhaust channel 480. It is contemplated that the controller may be configured to turn on the heat-exchange system for operating the compressor.

STEP 526: operating the multi-purpose fan for driving air through the exhaust channel

[92] During step 526 the controller is configured to operate the multi-purpose fan 250 for driving air through the exhaust channel 480 for removing latent heat. Additionally, or optionally, operating the multi-purpose fan 250 may comprise the controller configured to control a speed of operation of the multi-purpose fan 250. The controller may control the speed of operation based on sensor data received from one or more sensors of the cooling system 201 .

[93] It should be expressly understood that not all technical effects mentioned herein need to be enjoyed in each and every embodiment of the present technology. For example, embodiments of the present technology may be implemented without the user enjoying some of these technical effects, while other embodiments may be implemented with the user enjoying other technical effects or none at all.

[94] Modifications and improvements to the above-described implementations of the present technology may become apparent to those skilled in the art. The foregoing description is intended to be exemplary rather than limiting. The scope of the present technology is therefore intended to be limited solely by the scope of the appended claims.