Title:
COOLING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2014/156027
Kind Code:
A1
Abstract:
The present invention is provided with: a linear conductor (20) that has a cross section formed into a circular shape, has a metal wire having a purity of at least 99.999 mass%, and is formed having an average crystal grain size in a cross section of the metal wire that is at least 1/20 the diameter of the metal wire; a first connection section (21) connected to one end of the linear conductor (20); a second connection section (22) connected to the other end of the linear conductor (20); and a cooling device (30) that is provided between the first connection section (21) and second connection section (22) and that cools the linear conductor (20).
Inventors:
ASHIDA TETSUYA (JP)
YOSHIDA HIROSHI (JP)
HASHIMOTO KOUJI (JP)
YOSHIDA HIROSHI (JP)
HASHIMOTO KOUJI (JP)
Application Number:
PCT/JP2014/001445
Publication Date:
October 02, 2014
Filing Date:
March 13, 2014
Export Citation:
Assignee:
MITSUBISHI CABLE IND LTD (JP)
International Classes:
H02G15/34; H01B7/42; H01B12/16; H01L39/04
Foreign References:
| JPH04259359A | 1992-09-14 | |||
| JPS6461006A | 1989-03-08 | |||
| JPS6419618A | 1989-01-23 | |||
| JP2001229750A | 2001-08-24 | |||
| US20130065766A1 | 2013-03-14 |
Attorney, Agent or Firm:
MAEDA & PARTNERS (JP)
Patent business corporation MAEDA PATENT OFFICE (JP)
Patent business corporation MAEDA PATENT OFFICE (JP)
Download PDF:
Previous Patent: LINEAR CONDUCTOR AND METHOD FOR PRODUCING SAME
Next Patent: SOLID-STATE IMAGE PICKUP DEVICE AND IMAGE PICKUP DEVICE
Next Patent: SOLID-STATE IMAGE PICKUP DEVICE AND IMAGE PICKUP DEVICE