Title:
COOLING UNIT AND COOLING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2023/229026
Kind Code:
A1
Abstract:
This cooling unit has: a first cold plate and a second cold plate; an inflow pipe; and an outflow pipe. The first cold plate and the second cold plate are respectively disposed on both sides of a heat-generating component in a first direction. The inflow pipe allows refrigerant to flow into the first cold plate and the second cold plate. The refrigerant flowing out from the first cold plate and the second cold plate passes through the outflow pipe. At least a section of the first cold plate and at least a section of the second cold plate overlap in the first direction. At least a section of the inflow pipe and at least a section of the outflow pipe are disposed between the first cold plate and the second cold plate in the first direction.
Inventors:
KAWATA KEISUKE (JP)
TOKESHI TOSHIHIKO (JP)
TAMAOKA TAKEHITO (JP)
TOKESHI TOSHIHIKO (JP)
TAMAOKA TAKEHITO (JP)
Application Number:
PCT/JP2023/019661
Publication Date:
November 30, 2023
Filing Date:
May 26, 2023
Export Citation:
Assignee:
NIDEC CORP (JP)
International Classes:
H01L23/473; H05K7/20
Domestic Patent References:
| WO2020234600A1 | 2020-11-26 |
Foreign References:
| JP2020107759A | 2020-07-09 | |||
| JP2000340728A | 2000-12-08 | |||
| JPH1032292A | 1998-02-03 |
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