Title:
COPOLYMER, SURFACTANT, RESIN COMPOSITION, AND HEAT DISSIPATION SHEET
Document Type and Number:
WIPO Patent Application WO/2023/090239
Kind Code:
A1
Abstract:
A copolymer according to the present invention comprises a (meth)acrylic monomer unit A having an anionic group, a (meth)acrylic monomer unit B having a cationic group, and a (meth)acrylic monomer unit C other than the (meth)acrylic monomer unit A and the (meth)acrylic monomer unit B, wherein the weight-average molecular weight of the (meth)acrylic monomer unit C is 2,000 to 9,000. A surfactant according to the present invention includes said copolymer according to the present invention. A resin composition according to the present invention includes a resin, said surfactant according to the present invention, and an inorganic filler. A heat dissipation sheet according to the present invention includes said resin composition according to the present invention. With the present invention, it is possible to provide: a copolymer that can reduce the viscosity of a resin composition including a resin and an inorganic filler; a surfactant including said copolymer; a resin composition including said surfactant and an inorganic filler; and a heat dissipation sheet including said resin composition.
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Inventors:
WADA KOSUKE (JP)
KANAI TOMOYUKI (JP)
FUKAO KENJI (JP)
ARAI TATSUMI (JP)
ONOZUKA MASAO (JP)
IWASAKI TAKAYUKI (JP)
KANAI TOMOYUKI (JP)
FUKAO KENJI (JP)
ARAI TATSUMI (JP)
ONOZUKA MASAO (JP)
IWASAKI TAKAYUKI (JP)
Application Number:
PCT/JP2022/041838
Publication Date:
May 25, 2023
Filing Date:
November 10, 2022
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
C08F290/06; C08K3/013; C08K3/38; C08L55/00; C08L63/00; C08L83/04
Domestic Patent References:
| WO2020209263A1 | 2020-10-15 |
Foreign References:
| JP2011214000A | 2011-10-27 |
Attorney, Agent or Firm:
TAGUCHI, Masahiro et al. (JP)
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