Title:
COPOLYMERIZED POLYESTER, SHEET-LIKE ADHESIVE, MULTILAYER FILM AND MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2024/005196
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a copolymerized polyester which is suitable for use as an adhesive that has excellent handling properties and low environmental load, while being suitable for use in thermal three-dimensional molding. The present invention relates to a copolymerized polyester which has an aromatic group concentration in the copolymerized polyester of 5% by mass to 25% by mass, a glass transition temperature of -80°C to 10°C, and a melting point of 70°C to 130°C.
Inventors:
SAGISAKA RIZUMU (JP)
MIKAMI TADAHIKO (JP)
MIKAMI TADAHIKO (JP)
Application Number:
PCT/JP2023/024428
Publication Date:
January 04, 2024
Filing Date:
June 30, 2023
Export Citation:
Assignee:
TOYOBO MC CORP (JP)
International Classes:
C08G63/00; C09J7/30; C09J167/00
Domestic Patent References:
| WO2017159650A1 | 2017-09-21 | |||
| WO2019131471A1 | 2019-07-04 |
Foreign References:
| JP2009062453A | 2009-03-26 | |||
| JP2010241861A | 2010-10-28 | |||
| JP2010516847A | 2010-05-20 |
Attorney, Agent or Firm:
USFI PATENT ATTORNEYS INTERNATIONAL OFFICE (JP)
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