Title:
COPPER ALLOY AND METHOD FOR PRODUCING COPPER ALLOY
Document Type and Number:
WIPO Patent Application WO/2012/133651
Kind Code:
A1
Abstract:
Provided is a copper alloy, which has a composition, by at%, represented by the composition formula Cu100-a-b-c(Zr,Hf)a(Cr,Ni,Mn,Ta)b(Ti,Al)c [where 2.5≦a≦4.0, 0.1<b≦1.5, 0≦c≦0.2, (Zr,Hf) is one or two of Zr and Hf, (Cr,Ni,Mn,Ta) is one, two or more of Cr, Ni, Mn, and Ta, (Ti,Al) is one or two of Ti and Al]; has a Cu primary crystal wherein the average secondary dendrite arm interval is 2 µm or less; has a eutectic matrix having a lamellar interval of 0.2 µm or less that is formed from a quasistable Cu5(Zr,Hf) compound phase and a Cu phase; is beryllium-free; and has high strength and high conductivity, as well as good bendability. Also provided is a method for producing a copper alloy.
Inventors:
INOUE AKIHISA (JP)
NISHIYAMA NOBUYUKI (JP)
YAMAZAKI HARUKO (JP)
NISHIYAMA NOBUYUKI (JP)
YAMAZAKI HARUKO (JP)
Application Number:
PCT/JP2012/058358
Publication Date:
October 04, 2012
Filing Date:
March 29, 2012
Export Citation:
Assignee:
UNIV TOHOKU (JP)
INOE AKIHISA (JP)
NISHIYAMA NOBUYUKI (JP)
YAMAZAKI HARUKO (JP)
INOE AKIHISA (JP)
NISHIYAMA NOBUYUKI (JP)
YAMAZAKI HARUKO (JP)
International Classes:
C22C9/00; C22C9/01; C22C9/05; C22C9/06; C22F1/08; C22F1/00
Foreign References:
JP2005029857A | 2005-02-03 | |||
JPH0754079A | 1995-02-28 | |||
JP2009242882A | 2009-10-22 | |||
JP2008266787A | 2008-11-06 | |||
JP2005281850A | 2005-10-13 | |||
JP2501275B2 | 1996-05-29 | |||
JPH10183274A | 1998-07-14 | |||
JP2005281757A | 2005-10-13 | |||
JP2006299287A | 2006-11-02 | |||
JP2009242814A | 2009-10-22 | |||
JP2009242895A | 2009-10-22 |
Other References:
See also references of EP 2692877A4
Attorney, Agent or Firm:
SUDA Atsushi et al. (JP)
Atsushi Suda (JP)
Atsushi Suda (JP)
Download PDF:
Claims:
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