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Patent Searching and Data


Title:
COPPER ALLOY, COPPER ALLOY PLASTIC WORKING MATERIAL, COMPONENT FOR ELECTRONIC/ELECTRICAL EQUIPMENT, TERMINAL, BUSBAR, AND HEAT-DIFFUSING SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2021/107093
Kind Code:
A1
Abstract:
This copper alloy is composed of: Mg at a content within a range of 70 to 400 mass ppm; Ag at a content within a range of 5 to 20 mass ppm; and Cu and inevitable impurities as the balance. The P content is less than 3.0 mass ppm, the average crystal grain diameter is within a range of 10 to 100 μm, the electrical conductivity is 90% IACS or greater, and the residual stress percentage is 50% or greater at 150℃ for 1,000 hours.

Inventors:
MATSUNAGA HIROTAKA (JP)
ITO YUKI (JP)
MORI HIROYUKI (JP)
MATSUKAWA HIROYUKI (JP)
Application Number:
PCT/JP2020/044220
Publication Date:
June 03, 2021
Filing Date:
November 27, 2020
Export Citation:
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Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
C22C9/00; C22F1/00; C22F1/02; C22F1/08; H01B1/02
Domestic Patent References:
WO2019189558A12019-10-03
WO2019189534A12019-10-03
Foreign References:
JP2019178399A2019-10-17
JP2019178398A2019-10-17
JP2015086462A2015-05-07
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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