COPPER ALLOY, COPPER ALLOY PLASTIC WORKING MATERIAL, COMPONENT FOR ELECTRONIC/ELECTRICAL DEVICES, TERMINAL, BUS BAR, LEAD FRAME AND HEAT DISSIPATION SUBSTRATE

WIPO Patent Application WO/2022/004791

A1

One embodiment of this copper alloy has a composition that contains more than 10 mass ppm but less than 100 mass ppm of Mg, with the balance being made up of Cu and unavoidable impurities; among the unavoidable impurities, the amount of S is set to 10 mass ppm or less, the amount of P is set to 10 mass ppm or less, the amount of Se is set to 5 mass ppm or less, the amount of Te is set to 5 mass ppm or less, the amount of Sb is set to 5 mass ppm or less, the amount of Bi is set to 5 mass ppm or less and the amount of As is set to 5 mass ppm or less, with the total amount of S, P, Se, Te, Sb, Bi and As being set to 30 mass ppm or less; and the mass ratio (Mg)/(S + P + Se + Te + Sb + Bi + As) is set within the range of from 0.6 to 50. This embodiment has a conductivity of 97% IACS or more and a residual stress ratio of 20% or more at 150°C in 1,000 hours.

MATSUNAGA HIROTAKA (JP)
FUKUOKA KOSEI (JP)
MAKI KAZUNARI (JP)
MORIKAWA KENJI (JP)
FUNAKI SHINICHI (JP)
MORI HIROYUKI (JP)

PCT/JP2021/024764

January 06, 2022

June 30, 2021

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MITSUBISHI MATERIALS CORP (JP)

C22C9/00; C22F1/08; H01B1/02; H01B5/02; C22F1/00

WO2020122112A1

2020-06-18

JPS63310929A	1988-12-19
JP2008255417A	2008-10-23
JP2016056414A	2016-04-21
JP2019029605A	2019-02-21
JP2020112695A	2020-07-27
JP2020112927A	2020-07-27
JP2020181734A	2020-11-05
JP2016056414A	2016-04-21

MATSUNUMA Yasushi et al. (JP)

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