COPPER ALLOY PLASTIC WORKING MATERIAL, COPPER ALLOY ROD MATERIAL, COMPONENT FOR ELECTRONIC/ELECTRICAL DEVICES, AND TERMINAL

WIPO Patent Application WO/2022/004803

A1

This copper alloy plastic working material has a composition that contains more than 10 mass ppm but not more than 100 mass ppm of Mg, with the balance being made up of Cu and unavoidable impurities; among the unavoidable impurities, S is set to 10 mass ppm or less, P is set to 10 mass ppm or less, Se is set to 5 mass ppm or less, Te is set to 5 mass ppm or less, Sb is set to 5 mass ppm or less, Bi is set to 5 mass ppm or less and As is set to 5 mass ppm or less, with the total of S, P, Se, Te, Sb, Bi and As being set to 30 mass ppm or less; and the mass ratio (Mg)/(S + P + Se + Te + Sb + Bi + As) is set within the range of from 0.6 to 50. This copper alloy plastic working material has a conductivity of 97% IACS or more, a tensile strength of 275 MPa or less, and a heat resistance of not less than 150˚C after being subjected to drawing with the reduction ratio in cross-sectional area of 25%.

MATSUNAGA HIROTAKA (JP)
ITO YUKI (JP)
FUKUOKA KOSEI (JP)
MAKI KAZUNARI (JP)
MORIKAWA KENJI (JP)
FUNAKI SHINICHI (JP)
MORI HIROYUKI (JP)

PCT/JP2021/024797

January 06, 2022

June 30, 2021

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MITSUBISHI MATERIALS CORP (JP)

C22C9/00; H01B1/02; H01B5/02; C22F1/00; C22F1/08

WO2021107096A1

2021-06-03

JPS5789448A	1982-06-03
US20060198757A1	2006-09-07
JPS5794537A	1982-06-12
JPS4915324B1	1974-04-13
JP2016056414A	2016-04-21
JP2020112927A	2020-07-27
JP2020112695A	2020-07-27
JP2021091161A	2021-06-17
JP2016056414A	2016-04-21

MATSUNUMA Yasushi et al. (JP)

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