COPPER ALLOY, PLASTICALLY WORKED COPPER ALLOY MATERIAL, COMPONENT FOR ELECTRONIC/ELECTRICAL EQUIPMENT, TERMINAL, AND HEAT DISSIPATION SUBSTRATE

WIPO Patent Application WO/2022/004794

A1

This copper alloy includes more than 10 mass ppm and no more than 100 mass ppm of Mg and a remainder of Cu and unavoidable impurities. The unavoidable impurities include 10 mass ppm or less of S, 10 mass ppm or less of P, 5 mass ppm or less of Se, 5 mass ppm or less of Te, 5 mass ppm or less of Sb, 5 mass ppm or less of Bi, and 5 mass ppm or less of As, and the total of S, P, Se, Te, Sb, Bi, and As is 30 mass ppm or less. The mass ratio (Mg)/(S+P+Se+Te+Sb+Bi+As) is 0.6-50, the conductivity is 97% IACS or more, the half-softening temperature is 200ºC or more, the residual stress rate RSG in a direction parallel to the rolling direction after 30 hours at 180ºC is 20% or more, and the ratio RSG/RSB of the residual stress rate RSG and the residual stress rate RSB in a direction orthogonal to the rolling direction after 30 hours at 180ºC exceeds 1.0.

JPS52117244	CASING COMPONENTS FOR WATCH
JP2012064543	COAXIAL CABLE

MATSUNAGA HIROTAKA (JP)
FUKUOKA KOSEI (JP)
MAKI KAZUNARI (JP)
MORIKAWA KENJI (JP)
FUNAKI SHINICHI (JP)
MORI HIROYUKI (JP)

PCT/JP2021/024769

January 06, 2022

June 30, 2021

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MITSUBISHI MATERIALS CORP (JP)

C22C9/00; C22F1/08; H01B1/02; H01B5/02; C22F1/00

JP2017186623A	2017-10-12
JPH0372041A	1991-03-27
JP2016056414A	2016-04-21
JP2008255416A	2008-10-23
JP2001152267A	2001-06-05
JPH04280935A	1992-10-06
JP2020112695A	2020-07-27
JP2016056414A	2016-04-21

MATSUNUMA Yasushi et al. (JP)

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