Title:
COPPER ALLOY PLATE EXHIBITING EXCELLENT CONDUCTIVITY AND STRESS-RELAXATION PROPERTIES
Document Type and Number:
WIPO Patent Application WO/2014/064961
Kind Code:
A1
Abstract:
Provided are: a copper alloy plate provided with high strength, high conductivity and excellent stress-relaxation properties; a high-current electronic component and heat-discharging electronic component which use the copper alloy plate; and a method for producing the copper alloy plate. This copper alloy plate contains 0.01-0.50 mass% in total of Zr and/or Ti, with copper and inevitable impurities constituting the remainder thereof, and exhibits conductivity of 70% IACS or higher and a 0.2% yield strength of 330mPa or higher. Furthermore, the copper alloy plate has a stress-relaxation rate of 15% or less after being at 150°C for 1000 hours. In addition, the copper alloy plate may optionally contain 1.0 mass% or less of one or more of the following elements: Ag, Fe, Co, Ni, Cr, Mn, Zn, Mg, Si, P, Sn, and B.
Inventors:
HATANO TAKAAKI (JP)
Application Number:
PCT/JP2013/066875
Publication Date:
May 01, 2014
Filing Date:
June 19, 2013
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP (JP)
International Classes:
C22C9/00; C22C9/02; C22C9/04; C22C9/05; C22C9/06; C22C9/10; C22F1/08; H01B1/02; H01B5/02; H01B13/00; C22F1/00
Domestic Patent References:
| WO2012026611A1 | 2012-03-01 | |||
| WO2002012583A1 | 2002-02-14 | |||
| WO2012111567A1 | 2012-08-23 |
Foreign References:
| JP2004256902A | 2004-09-16 | |||
| JP2012012644A | 2012-01-19 |
Attorney, Agent or Firm:
AXIS Patent International (JP)
Axis international patent business corporation (JP)
Axis international patent business corporation (JP)
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