Title:
COPPER ALLOY POWDER FOR ADDITIVE MANUFACTURING HAVING EXCELLENT ELECTRICAL CONDUCTIVITY
Document Type and Number:
WIPO Patent Application WO/2022/215468
Kind Code:
A1
Abstract:
Provided is copper alloy powder suitable for additive manufacturing, with which a high-density high-electrical-conductivity shaped object can be manufactured. This copper alloy powder for additive manufacturing comprises: a total of 0.1 to 10% of Zr alone, or element M which is a combination of Zr and at least one kind selected from the group comprising Cr, Fe, Ni, and Nb; 50 to 500 ppm of O; 0% to 0.2% of Si; 0% to 0.2% of P; 0% to 0.2% of S; and the balance Cu and inevitable impurities. In a diffraction pattern of this copper alloy powder obtained by X-ray diffraction using a CuKα ray, where (1) represents a peak intensity at diffraction angle 2θ = 43.0 ± 0.2˚, (2) represents a peak intensity at diffraction angle 2θ = 43.5 ± 0.2˚, and (3) represents a peak intensity at diffraction angle 2θ = 50.2 ± 0.5˚, peak intensity ratio (1)/(3) is 1.5 to 2.5, and peak intensity ratio (2)/(3) is 2.5 to 3.5.
Inventors:
KUSE TETSUJI (JP)
AIKAWA YOSHIKAZU (JP)
SAKATA MASAHIRO (JP)
AIKAWA YOSHIKAZU (JP)
SAKATA MASAHIRO (JP)
Application Number:
PCT/JP2022/012026
Publication Date:
October 13, 2022
Filing Date:
March 16, 2022
Export Citation:
Assignee:
SANYO SPECIAL STEEL CO LTD (JP)
International Classes:
C22C9/00; B22F1/00; B22F3/16; B22F10/28; B33Y70/00; C22C9/06
Domestic Patent References:
| WO2019039058A1 | 2019-02-28 | |||
| WO2021015119A1 | 2021-01-28 | |||
| WO2019230018A1 | 2019-12-05 | |||
| WO2019239655A1 | 2019-12-19 |
Foreign References:
| JP2020186429A | 2020-11-19 |
Attorney, Agent or Firm:
TAKAMURA Masaharu et al. (JP)
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