Title:
COPPER ALLOY SHEET FOR HEAT DISSIPATING COMPONENT AND HEAT DISSIPATING COMPONENT
Document Type and Number:
WIPO Patent Application WO/2016/152648
Kind Code:
A1
Abstract:
Provided is a copper alloy sheet, with which a heat dissipating component can be given sufficient strength and heat dissipation capacity after being manufactured, in cases where a process of heating to 650°C or more is included as part of a heat dissipating component manufacturing process. The copper alloy sheet for heat dissipating components comprises 0.07 to 0.7 mass% of Fe, 0.2 mass% or less of P, with the ratio of the Fe content [Fe] and the P content [P], or [Fe]/[P], being from 2 to 5, and a remainder of Cu and inevitable impurities. The 0.2% proof stress is no less than 100 Mpa and the conductivity is no less than 50% IACS, subsequent to heating for 30 minutes at 850°C followed by water cooling and then aging treatment. If the copper alloy includes Sn, the contents of Sn and Fe are set to be within the range surrounded by point A (0.1, 0.006), point B (0.5, 0.006), point C (0.05, 1.1), and point D (0.05, 0.05) shown in drawing.
Inventors:
HASHIMOTO DAISUKE
NISHIMURA MASAYASU
NISHIMURA MASAYASU
Application Number:
PCT/JP2016/058122
Publication Date:
September 29, 2016
Filing Date:
March 15, 2016
Export Citation:
Assignee:
KOBE STEEL LTD (JP)
International Classes:
C22C9/00; C22C9/01; C22C9/02; C22C9/04; C22C9/05; C22C9/10; H01L23/373; C22C13/00; C22C13/02; C22F1/00; C22F1/08
Foreign References:
| JP2014189816A | 2014-10-06 | |||
| JPH09296237A | 1997-11-18 | |||
| JP2004232069A | 2004-08-19 | |||
| JP2001326308A | 2001-11-22 | |||
| JPS57192238A | 1982-11-26 | |||
| JPS63111151A | 1988-05-16 |
Attorney, Agent or Firm:
SAMEJIMA, Mutsumi et al. (JP)
Mutsumi Sameshima (JP)
Mutsumi Sameshima (JP)
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