COPPER ALLOY SHEET FOR HEAT DISSIPATION COMPONENT, AND HEAT DISSIPATION COMPONENT

WIPO Patent Application WO/2016/158390

A1

A copper alloy sheet is provided which, in the case that part of the process of manufacturing a heat dissipation component involves a process for heating to a temperature of 650°C or greater, makes it possible to maintain sufficient strength and heat dissipation performance in the heat dissipation member after manufacture. This copper alloy sheet for a heat dissipation component contains 1.0-4.0 mass% of Ni and/or Co and 0.2-1.2 mass% of Si, has a 3.5-5 ratio [Ni+Co]/[Si] of the total content of Ni and Co [Ni+Co] and the content of Si [Si], the remainder being Cu and unavoidable impurities, has a 300MPa or greater 0.2% proof stress after heating for 30 minutes at 850°C followed by water-cooling and subsequent aging treatment, and has a conductivity of 25% IACS or greater. This copper alloy can further contain one or more of Sn: 0.005-1.0 mass%, Mg: 0.005-0.2 mass%, and Zn: 2.0 mass% or less (not including 0 mass%).

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HASHIMOTO DAISUKE
NISHIMURA MASAYASU

PCT/JP2016/058177

October 06, 2016

March 15, 2016

Click for automatic bibliography generation  

KOBE STEEL LTD (JP)

C22C9/06; C22C9/02; C22C9/04; H01L23/373; C22C13/00; C22C13/02; C22F1/00; C22F1/08

JP2012153938A	2012-08-16
JP2015036438A	2015-02-23
JP2013204083A	2013-10-07
JPH09291325A	1997-11-11
JP2012211377A	2012-11-01

SAMEJIMA, Mutsumi et al. (JP)
Mutsumi Sameshima (JP)

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